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ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series

05/01/2024 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.

Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode

04/25/2024 | I-Connect007
In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.

Demand for NVIDIA’s Blackwell Platform Expected to Boost TSMC’s CoWoS Total Capacity by Over 150% in 2024

04/16/2024 | TrendForce
NVIDIA’s next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA’s own Grace Arm CPU in models such as the GB200, represents a significant development.

Amphenol Announces Pricing of Senior Notes Offering

04/05/2024 | Amphenol Corporation
Amphenol Corporation announced the pricing of its offering of $450 million aggregate principal amount of senior notes due 2027, $450 million aggregate principal amount of senior notes due 2029 and $600 million aggregate principal amount of senior notes due 2034.

Now Available: Episode 4, Season 2 of Designing for Reality—Lamination

04/04/2024 | I-Connect007
I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
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