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Federal Electronics Invests in HydroJet Inline Cleaning Technology at Hermosillo Facility

07/15/2025 | Federal Electronics
Federal Electronics, a leader in providing advanced electronic manufacturing services, has strengthened the advanced cleaning capabilities of its Hermosillo, Mexico facility with the recent installation of a HydroJet Inline Cleaner from Austin American Technology (AAT).

Japan’s OHISAMA Project Aims to Beam Solar Power from Space This Year

07/14/2025 | I-Connect007 Editorial Team
Japan could be on the cusp of making history with its OHISAMA project in its quest to become the first country to transmit solar power from space to Earth, The Volt reported.

Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability

07/10/2025 | Microchip
Continuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.

Green Circuits to Discuss High-Reliability Space Electronics in Booth 233 at the 2025 Small Satellite Conference

07/10/2025 | Green Circuits
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 39th Annual Small Satellite Conference, taking place August 10–13, 2025, in Salt Lake City, Utah.

ASMPT Introduces AERO PRO High-Performance Wire Bonder

07/09/2025 | ASMPT
ASMPT, the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, introduces its latest high-performance wire bonder: the AERO PRO.
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