-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling
April 9, 2024 | ESIEstimated reading time: 2 minutes
MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials.
To address the increased market pressure manufacturers face to deliver components that meet precise via and material requirements for today's advanced electronics, the next generation Geode™ G2 laser drilling system offers advancements in beam control capabilities, optical transmission, thermal management, and AOD technology. These innovations enable PCB manufacturers to meet the high accuracy and throughput demands of today's complex PCB applications that utilize high-frequency compatible materials and finer-pitched interconnects. The lightweight frame design of the Geode G2 provides extensive flexibility for factory floor layouts due to its smaller footprint and, combined with industry-leading application flexibility, enables customers to design the factory of the future.
"Our partners are working to resolve some of the most complex challenges in PCB via drilling, including producing new components in emerging technology markets such as low earth orbit satellites. They also face the challenge of building new factories within the rapidly expanding Southeast Asia market," said Michael Stubelt, MKS Vice President and General Manager - Equipment Solutions Business "We are committed to providing our customers with the most innovative CO2 laser drilling system on the market to help meet these challenges. We are proud to announce that the Geode G2 laser drill beta systems have proven successful in key applications, and we have recently received our first multi-unit order for high-volume manufacturing. This new system will allow our partners to push the boundaries of possibility in PCB manufacturing."
Geode™ G2 laser drilling system utilizes HyperSonix™ technology that shapes laser pulses with sound waves for better throughput and quality. In addition, AcceleDrill™ distributes pulse energy for maximum throughput and allows multiple via sizes in one pass. An industry first for CO2 via drilling, the Beam Characterization Tool (BCT) monitors beam quality and spot health while its automated run-time calibration lowers the cost of ownership.
The Geode™ G2 laser drilling system is available for purchase. More details can be found at www.esi.com, and system experts will be available at the IPC APEX Event, Anaheim, California, April 9-11 in booth 4412.
MKS Instruments enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, electronics and packaging, and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world’s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed, feature enhancement, and optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at www.mks.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
IEEE Study Shows Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics
07/22/2025 | PRNewswireMulti-wavelength light sources are required for optical transceivers to increase data. However, scaling the laser array size increases thermal crosstalk, which may affect laser efficiency and reliability.
indie’s LXM-U Laser Powers Next-Gen Quantum Technologies with Ultra-Low Noise Performance
07/14/2025 | indie Semiconductorindie, an automotive solutions innovator, is rapidly gaining industry adoption in its photonics portfolio, with indie’s latest ultra-low noise LXM-U lasers enabling next-generation quantum applications by delivering industry-leading frequency stability and integration flexibility.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).