Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards
April 10, 2024 | IPCEstimated reading time: 2 minutes
IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024. The Peter Sarmanian Corporate Recognition Award was presented to Summit Interconnect and the Stan Plzak Corporate Recognition Award was presented to Robert Bosch GmbH.
The Peter Samarian Corporate Recognition Award, named for a former IPC Board Chairman, recognizes an IPC-member company in the printed board industry (PCB) that has supported IPC through participation in technical and management programs while providing leadership for the industry.
Summit Interconnect is North America's largest privately held printed circuit board (PCB) manufacturer. Founded in 2017, four Summit locations are certified to the IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements standard, ensuring vetted and secure PCB supply to our nation's critical industries such as defense, aerospace, and medical electronics. Summit staff have been staunch supporters of IPC’s advocacy program, with staff serving on IPC’s North American Government Relations Committee, and USPAE Board of Directors, and attending numerous IPC IMPACT events in Washington, D.C.
More than 115 Summit staff members are Certified IPC Specialists (CIS), Certified IPC Trainers (CIT), or Certified IPC Designers (CID) to such standards as IPC-A-600 and IPC-6012.
Named for former IPC Board Chairman and founding member of the IPC Electronics Manufacturing Services Industry Management Council, the IPC Stan Plzak Corporate Recognition Award honors an IPC-member company in the electronics assembly industry (EMS) that actively contributes to the industry while supporting IPC technical and management programs.
Robert Bosch GmbH Group is a leading global supplier of technology and services, employing approximately 428,000 associates worldwide. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Mobility is the largest Bosch Group business sector, making the Bosch Group one of the leading automotive suppliers.
More than 15 Robert Bosch GmbH staff members serve on IPC standards development committees, and 35 members have earned CID and CIT certifications.
“IPC benefits tremendously from Summit and Bosch’s leadership and expertise,” said John W. Mitchell, IPC president and CEO. “Both organizations have consistently contributed staff resources and knowledge to standards development and other IPC programs and initiatives. Their involvement has directly contributed to IPC’s global growth in the electronics industry, and we are privileged to have them in our membership.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.