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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/15/2024 | Marcy LaRont, I-Connect007
We have quite a mix in this week’s must-reads. The November issue of Design007 Magazine was published, and you don’t want to miss Andy Shaughnessy’s column. This week, we also have a discussion of long-flex PCBs with CEE PCB’s Jerome Larez, and we revisit my forward-looking interview with Dr. Evelyne Parmentier of Dyconex. Jim Will gives us an update on the many things that have transpired in his first five months as executive director at USPAE. Finally, Happy Holden’s next installment of Happy’s Tech Talk looks into the weaknesses of CAD drawings by using a famous Escher print as an example. Happy is definitely one of a kind.

Pluritec Expands Service Network in the USA with New Hire in Chicago

11/18/2024 | Pluritec
Pluritec a leading supplier of machines for printed circuit boards, is excited to announce the expansion of its service network in the United States through the hiring new service engineer, Ernesto Raygoza, based in Chicago. This strategic move is designed to enhance Pluritec’s commitment to providing exceptional customer support and to better serve its growing client base throughout the region.

Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf

11/14/2024 | The Occam Group
The Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.

NetVia Group Invests in KLA's Frontline InCAM Pro Software

11/14/2024 | Epec
NetVia Group, a leading provider of advanced printed circuit boards (PCBs) and solutions for high-reliability industries, proudly announces its investment in and implementation of Frontline InCAM® Pro software.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2

11/14/2024 | I-Connect007 Editorial Team
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.
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