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IPC APEX EXPO 2024 Day 2: A Focus on Workforce Development
April 11, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Solving workforce development issues seemed to be a common theme among many conversations during the second day of IPC APEX EXPO 2024 in Anaheim, California.
In his keynote address, “The Future of the Human Workforce: Maximizing Potential in an Automated World,” IPC President and CEO Dr. John W. Mitchell discussed the rapidly evolving workforce climate. He noted the role that automation and AI can plan as a tool for the industry, allowing for a greater focus on the human aspect of a team, while also providing insight into how “gamification” can motivate and empower.
In an afternoon Design Community Town Hall, The Design Leadership Council and the Global IPC Internal Design Team (GIDT) gathered to tackle some challenging needs as IPC pivots to fill gaps in the design and manufacturing knowledge pool as the industry continues to evolve and our senior-age experts retire.
Peter Tranitz of IPC acknowledged the select industry experts on the councils and emphasized that their “one thousand years of combined knowledge” will come in handy as the groups collaborate on identifying and addressing some critically-needed updates in educational training programs.
IPC's Education Team also conducted an afternoon workforce development roundtable to discuss some regional issues and elaborate on IPC's efforts to help businesses through an apprenticeship model.
The show floor remained active as exhibitors eagerly provided presentations and made sales key to their operational and financial goals. The show floor also featured an ice cream social and poster presentations.
In our Real Time with… IPC coverage, I-Connect007 editors spoke with several industry representatives on Tuesday and Wednesday who wanted to discuss workforce development. Click here to view these and other important industry topics.
IPC APEX EXPO 2024 concludes today with a keynote presentation by IPC Chief Economist Shawn DuBravac at 2 p.m.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.