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                                                                                                        Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Emerging Engineers Get Formal Introduction to IPC APEX EXPO 2024
April 12, 2024 | Hannah GraceEstimated reading time: 1 minute
While IPC APEX EXPO didn’t officially cut the ribbon until Tuesday, several events were already taking place over the previous weekend. Anticipation was running high among professionals eager to explore the latest innovations. Among the highlights of the first day was the Emerging Engineer Reception, which shined a spotlight on the program designed for students and young professionals. This gathering provided a platform for guests to network and mingle, which fostered connections between seasoned industry experts and bright, enthusiastic newcomers.
The Emerging Engineer program stands out as a beacon for aspiring professionals, offering invaluable opportunities for mentorship, professional development, and involvement in IPC standards committees and development courses. For mentors attending the event, interacting with new top talent provides a fresh perspective and a boost of energy, which reignites a passion in their own careers.
As IPC APEX EXPO kicks off strong, the Emerging Engineer Reception sets the stage for an engaging and dynamic event. With collaboration and growth at the forefront of this program, IPC is paving a way for a bright future in the world of electronics.
Read more about what happens at IPC APEX EXPO 2024 in the upcoming Real Time With... Show & Tell Magazine.
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TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.