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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Emerging Engineers Get Formal Introduction to IPC APEX EXPO 2024
April 12, 2024 | Hannah GraceEstimated reading time: 1 minute
While IPC APEX EXPO didn’t officially cut the ribbon until Tuesday, several events were already taking place over the previous weekend. Anticipation was running high among professionals eager to explore the latest innovations. Among the highlights of the first day was the Emerging Engineer Reception, which shined a spotlight on the program designed for students and young professionals. This gathering provided a platform for guests to network and mingle, which fostered connections between seasoned industry experts and bright, enthusiastic newcomers.
The Emerging Engineer program stands out as a beacon for aspiring professionals, offering invaluable opportunities for mentorship, professional development, and involvement in IPC standards committees and development courses. For mentors attending the event, interacting with new top talent provides a fresh perspective and a boost of energy, which reignites a passion in their own careers.
As IPC APEX EXPO kicks off strong, the Emerging Engineer Reception sets the stage for an engaging and dynamic event. With collaboration and growth at the forefront of this program, IPC is paving a way for a bright future in the world of electronics.
Read more about what happens at IPC APEX EXPO 2024 in the upcoming Real Time With... Show & Tell Magazine.
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”