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IPC WinterCom 2024 Through the Eyes of One Dedicated Student
April 12, 2024 | Sanjay Huprikar, IPCEstimated reading time: 1 minute
Lauriane Testuz stands as a testament to the power of curiosity, perseverance, and the relentless pursuit of knowledge. Her story serves as a reminder that the path to success is often paved by an unwavering commitment to one's dreams.
Lauriane is a second-year student in electrical engineering at ENSEA, a specialized graduate school in France, who was invited to attend IPC WinterCom 2024 in Barcelona this past January. She has a passion for PCB design and assembly and found this event to be a fusion of learning, networking, and personal growth.
She was initially drawn to the world of artificial intelligence (AI), but her trajectory shifted when she discovered an affinity for PCB assembly during a university project. Guided by her school technician and armed with a newfound passion, Lauriane learned about IPC WinterCom. She decided to attend with a clear mission to deepen her understanding of PCB design and secure an internship abroad.
IPC WinterCom was a new event organized by IPC to support standards development committees in face-to-face sessions. During the weeklong series of meetings, the global electronics manufacturing industry met in Europe for the first time to develop and maintain the IPC standards they use to build electronics better.
To read the rest of this article, which appeared in the Spring 2024 issue of IPC Community, click here.
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AI Triggers Next Paradigm Shift in PDN
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Teledyne FLIR Defense to Deliver Portable Chemical Detectors to US Customs and Border Protection
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Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.