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Team Spirit: IPC's Global Advocacy Team Acting on Your Behalf
April 15, 2024 | Kate Koger, IPCEstimated reading time: 1 minute

The once seemingly apolitical world of printed circuits and soldering irons has evolved into the politically engaged electronics manufacturing industry that we know today. This landscape of technology is quickly evolving by intersecting innovation, economics, and politics. It has created a world where circuit boards and microchips meet lobbying efforts and legislative policymaking, and the decisions made in government chambers can profoundly impact the technologies that shape our lives. In this ever-changing environment, IPC has been at the forefront of advancing the collective voice of the industry.
We recognized the growing need for a more robust advocacy team to help navigate this new era of political engagement, both in the United States and Europe. We already feel a difference in establishing relationships with key legislators, bringing awareness to today’s technology trends through forums in Washington, D.C., on advanced packaging and high reliability; partnering with member companies on letters being sent to Congress; and through efforts to bring together OEM, PCB, and EMS supplier C-suite executives to discuss trends and challenges. Adding key members to our advocacy team has made many of these efforts possible.
Richard Cappetto recently joined IPC’s advocacy team as the senior director of North American government relations to spearhead efforts in Washington on behalf of the industry.
“In recent years, there has been a growing recognition of risks associated with the electronics supply chain, and policymakers are engaging with the industry to address the needs of our national security,” Rich says. “With the power to influence everything from healthcare to transportation, the importance of IPC member companies establishing a presence on Capitol Hill cannot be overstated. The decisions by the U.S. government are increasingly shaping the trajectory of our industry.”
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Brent Fischthal - Koh YoungSuggested Items
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.