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ENPASA Deploys Inmarsat NexusWave for Digital Operations and Crew Communications

10/14/2026 | Inmarsat
Buenos Aires-based shipowner Empresa Naviera Petrolera Atlántica SA (ENPASA) has deployed NexusWave – the fully managed, bonded multi-network connectivity service from Inmarsat Maritime, a Viasat company - across its large tankers Recoleta and Caleta Rosario reinforcing its commitment to operational excellence, digital transformation, and crew welfare.

TI Introduces ADC for Faster Telemetry in AI Data Centers

10/12/2026 | PRNewswire
At the Open Compute Project (OCP) Global Summit, Texas Instruments (TI) debuted the first analog-to-digital converter (ADC) to enable 24/7, low-power, event-based remote monitoring at nanosecond resolution.

Red Cat’s Blue Ops Partners with Florida Atlantic University for Maritime Defense

10/06/2026 | Globe Newswire
Red Cat Holdings, Inc. , a U.S. based provider of advanced all domain drone and robotic solutions for defense and national security, announced that its Blue Ops maritime division has established a strategic partnership with Florida Atlantic University (FAU) that will expand Blue Ops’ maritime defense operations to FAU’s Harbor Branch Oceanographic Institute in Fort Pierce, Florida.

Apple Executive Chair Tim Cook to Receive Semiconductor Industry’s Top Honor

09/22/2026 | SIA
The Semiconductor Industry Association (SIA) announced Apple Executive Chair Tim Cook has been selected as the 2026 recipient of the chip industry’s highest honor, the Robert N. Noyce Award.

Knocking Down the Bone Pile: Minimizing X-ray Dosage During PCB Inspection

09/23/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
The ability to non-destructively inspect PCB assemblies is extremely important for verifying product quality without compromising the assembly. X-ray inspection provides a non-destructive method for examining optically hidden features that cannot be evaluated using automated optical inspection (AOI) or microscopic inspection. This makes it particularly valuable for verifying solder joint interconnections beneath BGAs, chip-scale packages (CSPs), and other bottom-terminated components.
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