Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
FPT Unveils Strategic Directions, “All In” on AI, Automotive and Semiconductor
April 15, 2024 | BUSINESS WIREEstimated reading time: 2 minutes
FPT Corporation (FPT) announced its strategic directions for the 2024-2026 period at the 2024 Annual General Meeting, with five focused areas defined as Artificial Intelligence (AI), Automotive, Semiconductor, Digital Transformation, and Green Transformation.
According to FPT Chairman Dr. Truong Gia Binh, these five areas have shaped the course of modern history and will continue to be of critical importance in decades to come. In Vietnam’s case, they have been instrumental in solidifying the country's position as a global hub for business and innovation.
In this direction, AI remains at the heart of FPT's development strategy, aiming to serve at least 50% of Vietnamese citizens and 300 million global citizens. The Corporation is committed to expanding its AI ecosystem, continuing strategic partnerships with the world’s leading names, and embedding AI into all of its solutions and services. FPT's Generative AI and Visual AI solutions will also be tailored to cater to specific industry needs.
In the automotive sector, following the launch of FPT Automotive in 2023, FPT’s investment lies in the development of intelligent solutions, offering comprehensive automotive services. FPT Automotive aims to transition from software outsourcing to technical design for software-defined vehicles, targeting a 50% annual growth rate and a revenue of 1 billion USD by 2030.
With regard to the semiconductor industry, FPT has a dual target: supplying chips to more global customers and enhancing workforce development. FPT Chairman emphasized the Corporation’s aspiration to turn Vietnam into a powerhouse in semiconductor, mirroring its past success with software export. According to Dr. Truong Gia Binh, FPT will “fully integrate Vietnam into the global semiconductor ecosystem”. “We will establish joint ventures for IC design and testing and partner with local authorities to attract foreign investment in the semiconductor sector,” he added.
For the 2024-2026 period, FPT also aims to accelerate digital transformation, promote green transformation with smart transformation initiatives, further establishing its position as a leading partner for global businesses in these areas.
To accelerate these goals, mergers and acquisitions (M&A) will continue to be FPT’s strategic focus, especially in supporting the automotive sector. “FPT wants to acquire companies that manufacture and design cars,” said Dr. Binh. Its M&A activities this year will center around the US and expand to Japan, South Korea, Singapore, and Europe. These are built upon successful investments and M&A deals in 2023, notably with NAC, Cardinal Peak, AOSIS, Landing AI, and Intertec International.
In 2023, FPT exceeded its targets, recording an increase of 19.6% in revenue and 20.1% in pre-tax profit compared to the previous year. The year 2023 also witnessed a historic milestone for FPT, with the revenue from IT services for the global market exceeding $1 billion, generated by its subsidiary FPT Software. In 2024, FPT aims for a 17.5% revenue growth and an 18.2% increase in profit before tax.
Pham Minh Tuan, FPT EVP and FPT Software CEO, said: “Starting from 2024, the Corporation remains committed to deep investment, focusing on the development of high-value technologies like AI and Data, and ventures in rapidly growing sectors such as Automotive, Healthcare, Banking, Insurance, and Energy. We are determined to elevate our standards and surpass expectations to become a world-class company.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).