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Suggested Items

UHDI Fundamentals: UHDI Advances Neurotechnology

03/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains.

onsemi Achieves Validation of Near-Term Science-Based Emissions Reduction Targets

02/05/2025 | onsemi
The Science Based Targets initiative (SBTi) has approved onsemi’s near-term science-based emissions reduction targets. The validation of these targets attests that the planned decrease of onsemi’s greenhouse gas (GHG) emissions is aligned to the ambition of limiting global temperature rise to 1.5° Celsius.

RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research

01/16/2025 | Siemens
Siemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce™

Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative

01/13/2025 | BUSINESS WIRE
The U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.

Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem

01/13/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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