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NASA Aims to Fly First Quantum Sensor for Gravity Measurements

04/18/2025 | NASA
A lumpy, colorful 3D model of the Earth against a black background, illustrating variations in gravity. North and South America are visible. Red areas show higher gravity, blue areas show lower gravity.

Siemens Acquires Dotmatics to Extend AI-powered Software Portfolio to Life Sciences

04/07/2025 | Siemens
Siemens AG announces that it has signed an agreement to acquire Dotmatics, a leading provider of Life Sciences R&D software based in Boston, for $5.1 billion from Insight Partners.

STMicroelectronics, Innoscience Sign GaN Technology Development and Manufacturing Agreement

04/02/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing, announce the signature of an agreement on GaN technology development and manufacturing, leveraging the strengths of each company to enhance GaN power solutions and supply chain resilience.

DARPA Seeks Innovators to Create Revolutionary Tech for National Security

03/17/2025 | DARPA
DARPA’s Defense Sciences Office (DSO) is hosting Discover DSO Day (D3) in Chicago, April 23-24. The objective of the event is to connect DSO with the science and technology community in the Midwest to help generate world-leading technologies and capabilities for U.S. national security, which is critical to the Office’s mission of creating and preventing scientific surprise.

UHDI Fundamentals: UHDI Advances Neurotechnology

03/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains.
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