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Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity

05/08/2026 | Global Electronics Association
Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.

SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem

05/06/2026 | SEMI
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.

U.S. Semiconductor Industry Convenes at Glass4Chips Summit

05/04/2026 | NY CREATES
The 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia, and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging.

Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU

04/29/2026 | Hon Hai Precision Industry Co., Ltd.
Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.

Mitate Zepto Technica Joins JST Edge AI Semiconductor R&D Program as Implementation Partner

04/22/2026 | PRNewswire
Mitate Zepto Technica, Inc., based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST).
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