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USPAE Grants ‘Greater Access’ to Defense Electronics Manufacturers

01/20/2026 | Nolan Johnson, I-Connect007
Chris Peters, co-founder of the U.S. Partnership for Assured Electronics and expert on manufacturing supply chains, recently announced he would be stepping back from his role. I first met Chris in the spring of 2020, when SMT007 Magazine interviewed him for the July 2020 issue. I was pleased that Chris took the time to reflect on the USPAE, past present and future, and his optimism is infectious.

American Made Advocacy: How Congress Can Restore the U.S. Printed Circuit Board Industry

01/20/2026 | Shane Whiteside -- Column: American Made Advocacy
In 2026, the global PCB industry will see strong growth driven by data centers and the global race to create the most powerful artificial intelligence, along with the increased sophistication and production scale manufacturing of defense and infrastructure systems. Automotive technology innovations, the acceleration of unmanned systems production, and the continued proliferation of smart devices are also among the market forces driving global demand for microelectronics in general and PCBs in particular.

Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond

01/19/2026 | Edy Yu, Editor-in-Chief, ECIO
The Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.

Designers Notebook: Heterogeneous Interposer Design Challenge, Part 1

01/19/2026 | Vern Solberg -- Column: Designer's Notebook
The development of monolithic (system-on-chip) ICs revolutionized the electronics industry, enabling the creation of heterogeneous products by integrating multiple active elements within the same silicon base, which includes a central processing unit (CPU), memory functions, sensors, and communication tasks.

Advanced Electronic Packaging: How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia

01/19/2026 | Devan Iyer and Matt Kelly, Global Electronics Association
In November, more than 200 industry leaders, including government officials, regional domestic companies, multinational companies, and academic experts, gathered at the Olive Tree Hotel in Penang for the Advanced Electronic Packaging (AEP) Workshop, organized by the Global Electronics Association. With 15 expert speakers, three technical tracks, three expert panel discussions, and strong ecosystem participation, the workshop highlighted why advanced electronic packaging is central to the future of Malaysia’s semiconductor industry.
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