The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Three Industry Leaders Receive IPC President’s Award
April 17, 2024 | IPCEstimated reading time: 1 minute
In recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on April 9, 2024. Recipients were Nick Koop, TTM Technologies, Hiroyuki Watanabe, NEC Corporation, and Dieter Weiss, Weiss Engineering.
Nick Koop was instrumental in the creation of IPC standards that provide specifications for flex and rigid-flex, IPC-2223, and IPC-6013, along with material specifications and test methods. He also contributes to specifications for rigid PCBs, raw materials, final finishes, test methods, and common terminology. He serves as chair of the D-10 Flexible Circuits Committee and D-12 Flexible Circuits Specification Subcommittee and is a member of the Technical Activities Executive Council and the Chairman’s Committee Council.
Hiroyuki Watanabe serves as a member of the IPC Board of Directors and the IPC Thought Leader Program. A lecturer for the IPC engineering webinar series, he also presents webinars to Japan Regional Task Group members. An active participant in the IPC Asia Task Group meetings, Watanabe served as committee chair for the IPC-1792 standard and introduced the significance of that standard at an anti-counterfeiting symposium. He serves on the A-Team “Cyber Key Holder,” and participates in standards committee activities for 2-12A, 2-19A, 2-10, and 2-19C task groups.
Dieter Weiss provides market research on the European EMS industry under the brand in4ma. With IPC’s support, he built a unique database that provides the most qualified benchmarking data available for the EMS industry in Europe. He works on statistical disciplines that enable him to collect data, formulate statistical models, and predict and validate those models using algorithms that involve market segments, company size, and degree of vertical integration to best calculate revenue growth within the industry.
“The leadership and expertise of Nick, Watanabe-san, and Dieter are indispensable to our industry,” said John W. Mitchell, IPC president and CEO. “We show our appreciation for their significant contributions to IPC and the global electronics industry by presenting them with the IPC President’s Award.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.