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Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
April 17, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Editor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
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Sweeney Ng - CEE PCBSuggested Items
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
Akrometrix LLC Reports a Record Year of Revenue for 2024
03/04/2025 | Akrometrix LLCAkrometrix, the global leader in Thermal Warpage Metrology, announces financial results for the full year 2024.
Akrometrix Announces 30 Year Anniversary as Industry Leader in Thermal Warpage Metrology
02/25/2025 | Akrometrix LLCAkrometrix is celebrating their 30 year anniversary as an industry leader in thermal warpage metrology. Professor Ifeanyi Charles Ume founded Akrometrix out of Georgia Tech 30 years ago to address issues in PCB flatness using the shadow moiré warpage measurement technique.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
iNEMI HDI Socket Warpage Prediction and Characterization Webinar
11/15/2024 | iNEMIHigh-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.