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BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper

04/15/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.

Vinci Ships Production-Grade Thermo-Mechanical Simulation at Manufacturing Scale

02/25/2026 | BUSINESS WIRE
Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions.

Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium

11/05/2025 | Real Time with...SMTAI
In this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.

Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix

11/03/2025 | Real Time with...SMTAI
Marcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.

Driving Innovation: Mastering Panel Warpage

09/23/2025 | Simon Khesin -- Column: Driving Innovation
During the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
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