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INVISIO, U.S. Defense Innovation Unit (DIU) Advancing Wireless Tactical Communications Through Customer Collaboration

12/09/2024 | INVISIO
A cooperation between INVISIO and the U.S. Defense Innovation Unit (DIU) has showcased the benefits of co-development when it comes to developing tactical communications solutions for military operators at speed, resulting in the INVISIO Link™ solution.

ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield

12/02/2024 | ZESTRON
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield” 

NEOTech Significantly Improves Wire Bond Pull Test Process

11/25/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.

Innovation Advisory Team Launches: Advancing WHMA’s Strategic Vision for Industry Growth

11/21/2024 | IPC
The Wiring Harness Manufacturers Association (WHMA) announces the launch of its Innovation Advisory Team (IAT), a strategic initiative aimed at driving technological advancements, enhancing industry practices, and elevating quality and efficiency within the wire harness sector.

Würth Elektronik Offers its Radio Module for LoRaWAN Communication

11/19/2024 | Wurth Elektronik
Würth Elektronik launches Daphnis-I on the market – a slim, ultra-low power consumption and long range radio module for IoT applications.
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