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YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging

03/04/2025 | ACCESSWIRE
TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.

eInfochips Joins Samsung Advanced Foundry Ecosystem (SAFE™) to Drive Semiconductor Innovation

02/28/2025 | PRNewswire
eInfochips, an Arrow Electronics company, announced the company has joined the Samsung Advanced Foundry Ecosystem (SAFE™) as a Virtual Design Partner.

SEMI ISS Europe 2025 Speakers to Address AI, Sustainability, Supply Chain Resilience, and Workforce Development

02/17/2025 | SEMI
The SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, is themed AI: Catalyst to Propel Europe’s Competitiveness. The event will explore how AI is reshaping economic, technological, and market dynamics within the semiconductor industry.

European Chip Giants NXP, STMicroelectronics Prepare for Layoffs

02/06/2025 | I-Connect007 Editorial Team
While companies like NVIDIA dominate the headlines with announcements of record chip sales associated with AI, European chip makers that are more dependent on industrial and automotive electronics are under pressure as demands for their chips slow. NXP, headquartered in the Netherlands, recently announced disappointing financials, down 5% from the previous year, primarily due to softening demand in those markets.
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