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IDTechEx Report: Illuminating the Future of Lidar in Automotive

05/09/2024 | PRNewswire
In the rapidly evolving landscape of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, sensor technologies have emerged as a pivotal force driving innovations in the automotive industry.

Aegis Software Leads in IDC’s MarketScape 2023 Vendor Assessments for Manufacturing Execution Systems

05/10/2023 | Business Wire
Aegis Software, a global provider of Manufacturing Operations Management Software, announced it has been recognized by the IDC MarketScape as a Leader in Worldwide High-Tech and Electronics Manufacturing Execution Systems and Worldwide Engineering-Intensive Manufacturing Execution Systems, and recognized as a Major Player in Worldwide Discrete Manufacturing Execution Systems.

Ansys Joins TSMC's OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud

04/27/2023 | ANSYS
Ansys announced that it has joined TSMC's OIP Cloud Alliance to facilitate the deployment of fully distributed workflows for mutual customers. By driving toward the cloud interoperability of Ansys multiphysics solutions with TSMC's technology enablement, customers will easily be able to gain the full benefits of faster run times and elastic computing with major cloud vendors.

Advanced Packaging Means Advanced Routing Issues

01/26/2023 | Kris Moyer, IPC
In today’s ever-shrinking world of electronics designs, the use of BGA parts with very fine pitch features is becoming more prevalent. As these fine-pitch BGAs continue to increase in complexity and user I/O (number of balls), the difficulty of finding escape routes and fan-out patterns increases. Additionally, with the shrinking of silicon geometry leading to both smaller channel length and increased signal integrity issues, some of the traditional BGA escape routing techniques will require a revisit and/or adjustment to allow for not only successful fan-out, but also successful functioning of the circuitry of the BGA design.

Indium Corporation to Deliver Keynote Presentation on e-Mobility at SMTA California Expos

10/11/2022 | Indium Corporation
Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will deliver the keynote presentation on market trends in the thriving electric vehicle (EV) landscape at the Surface Mount Technology Association’s (SMTA) LA/OC Expo & Tech Forum.
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