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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 19, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes
Last week was IPC APEX EXPO 2024 in Anaheim, California. There were more than 400 exhibitors, many displaying impressive equipment, and five full days of committee meetings, personal development courses, technical presentations, and special technical sessions. For those of us still recovering, suffice it to say that it was a full week.
I had the privilege of doing over 20 Real Time With… IPC APEX EXPO 2024 video interviews and want to express gratitude to my interviewees, who were both interesting to talk to and patient with the process. Another highlight for me was talking to young engineers and other professionals at the show, some of whom took on the mantle of guest editor in our interview booth.
In case you missed the show this year or simply want to revisit some of the highlights, be sure to catch our Show & Tell 2024 issue coming soon.
For my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest e-books (there are several) that you do not want to miss if you are an assembler.
It’s Only Common Sense: Here’s What To Do After IPC APEX EXPO 2024
Published April 15
Dan Beaulieu never disappoints in dispensing some valuable pearls for the business masses. In this column, he cautions us not to move on too quickly from IPC APEX EXPO upon returning home. The real work of the show is just beginning, and it all starts with following up (immediately). Of course, you are tracking the business you get that can be attributed back to the show for ROI, but Dan also reminds us to assess “true value” by accurately tracking our expenses and looking at the things that may not directly lead to a P.O. but that make our companies better. Take a moment to remind yourself of the post-show best practices and 2025 show planning we should all be doing.
Material Insight: The Importance of Standards for the Chip Packaging Industry
Published April 12
I seem to be mentioning “chips,” “chiplets,” and “packaging” a lot in my articles of late. On its face, it is PCB adjacent at best, but in reality, it informs everything we will be doing—including choosing whether to participate in next-gen technology. Preeya Kuray’s column covering her takeaways from the NIST CHIPS R&D Chiplets Technical Standards Workshop (a mouthful, as event titles go) is worth a few moments of your time. She discusses the benefits of system in package (SiP), which includes greater flexibility and faster time to market, and highlights that the most pressing issue that was covered was the need to create standards for safe data sharing.
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
Published April 11
In my mind, this article is a great companion to the podcast of the same name. Matt Stevenson starts out by stating simple reality: “PCB manufacturing is the physical manifestation of a digital design, and to design manufacturable boards, it’s important to understand how they are produced.” He moves on to highlight the critical importance of automation and software to the PCB designer, choosing the right CAD tools, and anticipating the inevitable variation between the different PCB fabricators you will work with.
Seeking Employment: Meet Parker Capers
Published April 18
Having a college student son myself, I appreciate our Seeking Employment series. This week, we invite you to meet Charlie Capers. He recently graduated from DeVry with a degree in information technology and cybersecurity. An SMT legacy “kid,” having worked for his father’s company for many years prior to his graduation, Parker says he knows manufacturing and would love to take a cybersecurity position in a small- to medium-sized manufacturing company. “Every industry needs cybersecurity,” he says, and cites the human factor as every company’s weak link when it comes to falling prey to cybersecurity threats.
I-Connect007 Adds to Technical Library With Book on Factory Analytics by Cogiscan
Published April 3
Technically, this article is from the week before last, but I will use IPC APEX EXPO (for the last time) as an excuse. If you have not yet seen it, you owe it to yourself to check out our latest book, The Printed Circuit Assembler’s Guide to Factory Analytics: Unlocking Efficiency Through Data Insights. This book by Julie Cliche-Dubois is a must-read for assemblers. In his recommendation of the book, Jason Sciberras, president of Saline Lectronics, said, “I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book.” In short, don’t download it if you are not interested in taking your operations to the next level.
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Rachael Temple - AlltematedSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
A 60-Year Legacy of PCB Innovation from IEC
04/17/2026 | Real Time with... APEX EXPOChris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
Take the Mic: Smart and Flexible SMT Solutions from Essemtec
04/03/2026 | Real Time with... APEX EXPOEssemtec is known for naturally adaptive machines inspired by nature and designed for advanced HDI as well as package substrate manufacturing. Pierre-Jean Cancalon discusses new 2K dispensing and high-speed solder paste jetting technologies, perfect for NPI prototyping and flexible production environments.