Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Intel AI Platforms Accelerate Microsoft Phi-3 GenAI Models

05/27/2024 | Intel Corporation
Intel has validated and optimized its AI product portfolio across client, edge and data center for several of Microsoft’s Phi-3 family of open models.

Nortech Systems Announces New Patent for Active Optical Xtreme for Sophisticated Magnetic Environments

05/24/2024 | Nortech Systems
Nortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical, aerospace & defense and industrial markets, announced the issuance of a new patent for their groundbreaking Active Optical Xtreme (AOX) technology platform.

Unique Look Behind the Scenes of AT&S Research

05/23/2024 | AT&S
The technology leader AT&S already holds almost 800 patents and is giving an insight into its R&D departments in Leoben at the “Long Night of Research” on May 24. But some things remain top secret: the new research center and Europe’s first substrate plant recently installed a high-tech machine that is unique in the world. It allows the exposure of substrate structures that are 14 times thinner than a human hair.

The Rise of Collaborative Intelligence in Manufacturing

05/22/2024 | Jennifer Davis, Arch Systems
Every modern manufacturer grapples with a common challenge: extracting actionable insights from the ever-growing sea of operational data. The challenge of the data deluge isn’t just overwhelming; it coincides with a broader shift in automation needs. While traditional forms of automation, such as robots, remain vital, the focus is expanding to encompass automating the very intelligence needed to run a factory efficiently. As a result, a new generation of tools and technologies, including artificial intelligence (AI) is beginning to transform the way factories operate.

Dana on Data: The Insane PCB DFM Process

05/22/2024 | Dana Korf -- Column: Dana on Data
This industry just doesn’t like to change. Line width/space is consistently narrowed; layer counts are now over 120 layers; via diameters constantly shrink. But a fabricator still can’t build per the supplied data package because of design, document, and capability mismatch errors. I have been writing for I-Connect007, and of the 41 articles and interviews I have done, 39 have focused on highlighting designer-to-fabricator data transfer issues with proposed solutions. Little has changed to improve the transfer. This industry seems to accept receiving erroneous PCB data.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in