-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueTechnical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
April 22, 2024 | Zentech ManufacturingEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/3217/1379/7783/Matt_Turpin_Zentech.jpg)
Turpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
He will oversee the company's strategic direction, ensuring innovation and a quality focus to drive customer success. He is an active industry leader, serving as the Chairman of the Advanced Technology Taskforce for Maryland (GWDB), Maryland Regional Manufacturing Institute (RMI), the IPC, and the US Partnership for Assured Electronics. Turpin holds a BS in Business from the University of Maryland.
“I’m honored to return to Zentech and work alongside its talented team across all sites," said Turpin. "We have a tremendous opportunity to build on the company’s strengths and deliver exceptional value and quality to our customers."
Suggested Items
ESIA Urges the EU to Move to Action
02/10/2025 | ESIAThe European Commission unveiled its anticipated ‘Competitiveness Com- pass for the EU’. The European Semiconductor Industry Association (ESIA), represent- ing the semiconductor industry and broader ecosystem in Europe, welcomes this initi- ative that “lists priority actions to reignite economic dynamism” in the EU.
Empowering Interns: Shaping Tomorrow's Tech
02/10/2025 | Marcy LaRont, PCB007 MagazineToday, we widely accept that creating and leveraging opportunities to fill our future tech workforce is paramount to future success—both as individual companies and as an industry. This is even more true, and certainly more challenging, for in-person manufacturing jobs. In our conversation, Gerry Partida of Summit Interconnect focuses on the essential role of interns in the technological landscape and emphasizes how nurturing their skills and potential contributes significantly to the future of technology and business operations in our companies today.
OE-A Elects New International Board of Directors
02/07/2025 | OE-AThe members of the OE-A (Organic and Printed Electronics Association) appointed Dr. Alain Schumacher, IEE, as the new Chair of the Board of Directors at the end of January. Dr. Luke Pan, Brilliant Optoelectronic Technology is the new Vice Chair for Asia. Dr. Carsten L. Herzhoff, Lohmann, and Dr. Chloé Bois, ICI, are elected as Vice Chair Europe and North America respectively.
New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
02/06/2025 | IPCA new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance.
First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries
02/06/2025 | IPCThe first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents.