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ESIA Urges the EU to Move to Action

02/10/2025 | ESIA
The European Commission unveiled its anticipated ‘Competitiveness Com- pass for the EU’. The European Semiconductor Industry Association (ESIA), represent- ing the semiconductor industry and broader ecosystem in Europe, welcomes this initi- ative that “lists priority actions to reignite economic dynamism” in the EU.

Empowering Interns: Shaping Tomorrow's Tech

02/10/2025 | Marcy LaRont, PCB007 Magazine
Today, we widely accept that creating and leveraging opportunities to fill our future tech workforce is paramount to future success—both as individual companies and as an industry. This is even more true, and certainly more challenging, for in-person manufacturing jobs. In our conversation, Gerry Partida of Summit Interconnect focuses on the essential role of interns in the technological landscape and emphasizes how nurturing their skills and potential contributes significantly to the future of technology and business operations in our companies today.

OE-A Elects New International Board of Directors

02/07/2025 | OE-A
The members of the OE-A (Organic and Printed Electronics Association) appointed Dr. Alain Schumacher, IEE, as the new Chair of the Board of Directors at the end of January. Dr. Luke Pan, Brilliant Optoelectronic Technology is the new Vice Chair for Asia. Dr. Carsten L. Herzhoff, Lohmann, and Dr. Chloé Bois, ICI, are elected as Vice Chair Europe and North America respectively. 

New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing 

02/06/2025 | IPC
A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance.

First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries

02/06/2025 | IPC
The first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents.
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