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An Open Invitation to Standards Development in Paris

09/14/2026 | Marcy LaRont, I-Connect007
The Global Electronics Association is doing something a little different around standards this year. IPC Builds, Sept. 19–24, in Paris, is a series of standards development meetings open to both Association members and nonmembers, offered at no charge, with lunch provided. Sponsoring an event like this at no charge caught my attention. Removing any registration cost clearly removes a barrier to participation at a time when global input into standards development is needed more than ever. An open forum naturally makes it easier for someone who is curious about standards work or has wanted to get involved but hasn’t yet taken the first step to experience the process firsthand, with no risk or expectation.

IPC-1751 Builds Supply Chain Infrastructure for the Future

09/01/2026 | Nolan Johnson, I-Connect007
IPC-1751 Committee Chairs Nikki Johnson, VP of operations and regulatory at Source Intelligence, with over 20 years of experience in compliance standards, and Dr. N Nagaraj, a chemical engineer and former NASA contractor who helped develop early IPC compliance solutions, discuss IPC-1751, the newly adopted JSON-based standard that replaces the older XML format. In this roundtable-format conversation, Johnson and Nagaraj explain how IPC-1751 serves as a modular "envelope" that connects related standards (IPC 1752–1757, IPC-1782) for material composition, lab reports, and conflict minerals.

North American PCB Demand Strengthens as July Bookings Surge 62%

08/25/2026 | Global Electronics Association
The Global Electronics Association announced the July 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.46.

North American EMS Orders Surge in July as Book-to-Bill Stands at 1.29

08/25/2026 | Global Electronics Association
The Global Electronics Association announced today the July 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.

Winners of Hand Soldering Competition Vietnam 2026 Announced

08/14/2026 | Global Electronics Association
The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.
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