Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Schweizer Electronic Appoints Thomas Gottwald as New Member of the Executive Board
April 23, 2024 | Schweizer Electronic AGEstimated reading time: Less than a minute
The Supervisory Board of Schweizer Electronic AG has appointed Mr. Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of 3 years with effect from 1 May 2024.
Mr. Thomas Gottwald has been working at Schweizer Electronic AG for over 30 years. In his previous positions he has contributed significantly to the development of the p² Pack embedding technology, which is groundbreaking for our company. Mr. Gottwald startet his career in 1991 in process technology and after various achievements - such as the introduction of HDI technology at SCHWEIZER - he took over responsibility for our future technologies as Director of Innovations. In his most recent role as Vice President Technology, Gottwald was responsible for Innovations, Product Management, IP-Management and the Front End.
"We are very pleased to have Thomas Gottwald as our CTO and to have further strengthened the technological expertise of our Executive Board", said Dr. Stefan Krauss, Chairman of the Supervisory Board.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).