-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
April 24, 2024 | IPCEstimated reading time: 1 minute
At IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
As finalists in the third annual IPC Design Competition, the five designers were invited to IPC APEX EXPO to compete in a five-hour layout challenge, to place components and route a board, compliant to relevant IPC standards. As part of the finals heat, competitors used Altium Designer, and a project was provided with stackup and board geometry complete, with certain critical components pre-placed. All other components were left to be placed at the discretion of the competitors.
At the end of the round, each competitor delivered their project file to judges Kris Moyer and Patrick Crawford, IPC; Steve Roy, Roy Design and Manufacturing Service; Russell Steiner, Amphenol; Kevin Kusiak and David Caputa, Lockheed Martin. The judges placed weight on examining completeness of the board (i.e., how many routed nets) vs. critical errors – namely short circuits, clearance violations, via producibility, and various signal integrity aspects.
After an intense 2.5-hour judging process, Dinesh G., lead turnkey, Sienna ECAD, took first place with his PCB design.
Second place went to Paul Brionez, CID+, senior PCB design layout engineer, Wisk Aero. Third place went to Ajeesh Francis, senior PCB engineer, Tessolve Semiconductor Pvt. Ltd.
Runners-up included: Joseph Chiu, ToyBuilder Labs and Harish G., senior engineer, R&D-Mobility, Exicom Tele-Systems Ltd.
To learn more about IPC’s design initiative, visit ipc.org/solutions/ipc-design.
Suggested Items
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
07/16/2025 | SEMIElectronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.