Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
April 25, 2024 | Taiyo Circuit AutomationEstimated reading time: 2 minutes
Taiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
The DP3500 coater is a semi-automatic double-sided screen printer. The DP3500 comes with the new Smart Print System which delivers superb quality with panel thickness tolerance of 0.1 – 4 mm combined with a toolless magnetic gripper system that tensions the panel as it prints. Additionally, the new HMI Touch Screen, Differential Print Pressure Control System and Servo Controlled Peel Off features and Shur-Loc screen system now come as standard.
Fuba’s DP3500 is combined with Taiyo’s new PSR-4000 solder mask system, the global leading solder mask product, combined will complete the newly designed “Taiyo Zone” print room at Fuba.
“Fuba has been a long-standing partner of Taiyo Circuit Automation, having had a DP1500 for many years. This new DP3500 coater will support Fuba’s continued growth into new technology sectors as they transition away from curtain coating. The DP3500, with its new multi programmable settings for panel type, size, and thickness, combined with extraordinary print quality with Taiyo’s PSR-4000 solder mask is a winning combination as demonstrated by thousands of customers worldwide. Taiyo’s PSR-4000 solder mask brand is the highest volume selling solder mask in the world. This is the perfect turnkey solution for Fuba and many other PCB manufacturers," said Stuart Down, Global Sales Manager for Taiyo Circuit Automation.
Takuji Maekawa, CEO of Taiyo Circuit Automation, Inc. added, "The collaboration with Fuba aligns perfectly with our vision of Taiyo Circuit Automation, Inc. Their reputation as a leader in PCB industry complements our commitment to providing excellence in print quality through the industry leading superb coating and automation technologies of Taiyo Circuit Automation, Inc., and we look forward to a fruitful partnership."
“The entire installation process went well with very little down time. Taiyo Circuit Automation’s and Taiyo America process engineers were on site with support from Fuba’s team provided outstanding support during the transition,” said Mohamed Hamouda Production& Maintenance Director.
“The solder mask tolerances across the panel have greatly improved due to the smart print system, and we are now looking ahead to working with Taiyo on their new PSR-4000 HH01XR DI melamine free system and leading automotive solder mask solution PSR-4000 AM81," commented Hedi Abbes, Deputy General Manager.
Taiyo Circuit Automation, Inc. was established as a subsidiary of Taiyo America, Inc in 2020, in Carson City, NV. Taiyo Circuit Automation design and manufacture the world’s finest dual-sided solder mask coating, vertical drying equipment and more recently robotics to aid in automating the coating process. Taiyo Circuit Automation have served the Global printed circuit industry with highly reliable innovative machinery, engineered to exceed expectations.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.