Happy’s Tech Talk #37: New Ultra HDI Materials
It’s Only Common Sense: When Data Isn’t Enough, Trust Your Gut
Marcy’s Musings: Fueling the Workforce Pipeline
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
April 29, 2024 | IPCEstimated reading time: 1 minute
IPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Arlon produces and sells military-grade, copper-clad laminates, prepregs, and packaging substrates to the global electronics industry. The company continues to be listed as an IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards trusted source capable of manufacturing in accordance with industry best practices for IPC slash sheets 40, 41, and 42, the polyimide-based slash sheets covered in IPC-4101E. Arlon successfully requalified their product 33N, 35N and 85N to slash sheets 40 and 41 of IPC-4101E. Arlon also successfully requalified their products 37N and 38N to meet the requirements of slash sheet 42.
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also audits and certifies electronics companies' products and identifies processes that conform to IPC standards.
“Arlon has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize Arlon for their requalification and for being the first U.S. facility to be a trusted supplier conforming to IPC-4101E as well as covering all three polyimide specification sheets.”
Share on:
Suggested Items
The Test Connection, Inc. to Showcase Advanced Testing Solutions at SMTA Austin Expo & Tech Forum
02/04/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce its participation in the SMTA Austin Expo & Tech Forum on February 6, 2025 in Austin, Texas.
Nolan's Notes: Find the Help You Need—Accessing Technical Resources
02/04/2025 | Nolan Johnson -- Column: Nolan's NotesSome close friends of mine have a card catalog in their family room—with the cards still in it. It’s just a novelty now, but it wasn’t that long ago that the card catalog was the end-all, be-all of research resources. As a college student, I remember something like two dozen or more of the very large card catalog cabinets in the Oregon State University Library. It’s not lost on me that my friend’s card catalog “liberated” from the university is a snapshot of that particular knowledge base at that particular moment in time. Today’s access to a library’s contents have changed dramatically.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
01/28/2025 | Michelle Te, IPC CommunityIPC’s Emerging Engineer program provides professionals an opportunity early in their careers to learn from dedicated industry volunteers participating in standards development. Two participants in the program—Brian Chislea, Dow Chemical, mentor to AJ Arriaga, Summit Interconnect—share their experiences in the program in a series of articles. We will follow them through their three years in the mentorship. This is the first in the series.
The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs
01/24/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce the launch of its newest venture, The Training Connection, LLC, a company dedicated to addressing the growing need for practical and effective training in test engineering and development. With a focus on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection is poised to empower professionals with the tools and expertise they need to excel.