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Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
April 29, 2024 | IPCEstimated reading time: 1 minute
IPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Arlon produces and sells military-grade, copper-clad laminates, prepregs, and packaging substrates to the global electronics industry. The company continues to be listed as an IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards trusted source capable of manufacturing in accordance with industry best practices for IPC slash sheets 40, 41, and 42, the polyimide-based slash sheets covered in IPC-4101E. Arlon successfully requalified their product 33N, 35N and 85N to slash sheets 40 and 41 of IPC-4101E. Arlon also successfully requalified their products 37N and 38N to meet the requirements of slash sheet 42.
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also audits and certifies electronics companies' products and identifies processes that conform to IPC standards.
“Arlon has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize Arlon for their requalification and for being the first U.S. facility to be a trusted supplier conforming to IPC-4101E as well as covering all three polyimide specification sheets.”
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Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.