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epoxySet introduces a new and unique, urethane potting compound. The UC-2210M was formulated to protect electronic components in high moisture and thermal environments including constant atmospheric exposure, oceanographic environments and high humidity conditions.
This room temperature curing system is easy to apply as a potting, encapsulation or casting compound. The low viscosity allows for easy air removal as well as penetration of intricate encapsulated areas.
UC-2210M cures to a semi-rigid polymer that minimizes stresses on delicate and sensitive components. It has good thermally conductive thus further protecting electronics from heat stresses. Offering exceptional thermal shock from -55 to 130 °C, it also provides high impact resistance.
