-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IMI Championing Collaborative Partnerships
April 30, 2024 | IMIEstimated reading time: 1 minute

Integrated Micro-electronics, Inc. (IMI) held its virtual 2024 Annual Stockholders Meeting at Fairmont Hotel Makati on Thursday, 25 April 2024.
The year 2023 was a year of championing collaborative partnerships for IMI.
Chairman Alberto M. de Larrazabal and outgoing CEO Arthur R. Tan shared how the company remained bullish and resilient amidst the various headwinds experienced in the past year.
“Through deeper collaboration with major partners to address the uncertainties of the supply chain and the operating landscape, the core businesses of IMI managed to stay profitable for the past three years,” said Larrazabal.
“Despite a challenging year in 2023 with still raised levels of costs of inputs and geopolitical issues affecting global supply chains, the company continued to bring in business with a total sales of US$1.3 billion. With our capabilities, certifications, and management approach which remain a key strategic advantage and long-term value driver, IMI won new projects that have an annual revenue potential of US$291 million mostly in the mobility and industrial segments,” Tan asserted.
Arthur R. Tan is retiring after 22 years as CEO of IMI. Lou Hughes was nominated by the Board to succeed Arthur Tan effective May 1, 2024. Hughes has several years of experience in the industry, with a depth of experience in sales, engineering, sourcing, and operations, and a broad range of executive duties for both private and publicly listed EMS companies.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.