Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
April 30, 2024 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center. The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. Koh Young is proud to be the exclusive gala sponsor of the 74th ECTC.
The technical program includes papers covering leading edge developments and technical innovations across the packaging spectrum, including topics like assembly and manufacturing technology, advanced packaging, as well as emerging technologies in both poster and presentation formats. The panel, plenary, special sessions, and EPS seminar provide conference participants with an opportunity to gain insights and perspectives from industry leaders.
The ECTC Exhibition complements the strength of the ECTC technical program with an opportunity for engineers and decision makers to collaborate with Koh Young and other packaging companies. “With our market-leading, AI-powered complement of inspection machines designed to reduce waste with zero-defect production via automated process control and autonomous optimization, we have the expertise and solutions to help manufacturers improve their processes,” remarked Brent Fischthal, Head of Global Marketing at Koh Young. “We will be in booth 724 during the exhibit hours and available to discuss your advanced packaging and wafer level inspection and application challenges.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.
YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications
10/24/2025 | BUSINESS WIREYield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, announced that it has received multiple tool orders from a global leader in AI infrastructure solutions.
TSMC Reports Third Quarter EPS of NT$17.44
10/22/2025 | TSMCTSMC announced consolidated revenue of NT$989.92 billion, net income of NT$452.30 billion, and diluted earnings per share of NT$17.44 (US$2.92 per ADR unit) for the third quarter ended September 30, 2025.
Global Electronics Association Releases Fall Schedule of Instructor-led Courses
10/20/2025 | Corey Lynn, Global Electronics AssociationWhether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.