Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IPC Hosts Advanced Packaging Symposium in Tokyo

06/13/2024 | IPC
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.

Koh Young at SEMICON West with a Focus on Inspection & Metrology for Semiconductor and Advanced Packaging Challenges

06/04/2024 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions, will demonstrate its ZenStar and Meister Series of automated inspection and metrology tools for semiconductor and advanced package applications in booth 1833 at SEMICON West, taking place from July 9-11, 2024, at the Moscone Center in San Francisco, CA.

SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores

05/29/2024 | GlobeNewswire
SCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.

Chiplet Architecture for AI Will Create New Demands for Assembly

05/28/2024 | Nolan Johnson, SMT007 Magazine
As we look deeper into the entire AI ecosystem, it becomes clear that AI algorithms are intensely hungry for compute power. This demand for compute resources is accelerating beyond the customary rate predicted by Moore’s Law, just as traditional semiconductor fabrication methods are failing to maintain Moore’s Law. It’s a real dilemma.

Delving Into Special Sessions at IPC APEX EXPO 2024

05/28/2024 | Happy Holden, I-Connect007
Once again, we were back at IPC APEX EXPO for another show and conference, and back to gathering in the Anaheim Convention Center. With Disneyland just across the street, there were tourists everywhere. This APEX EXPO was bigger than ever, with more activities, Professional Development Courses, standards committee meetings, and the 16th Electronic Circuits World Convention. I really enjoyed walking around and seeing everything the show had to offer.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in