TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
April 30, 2024 | PRNewswireEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/4717/1448/4448/TSMC_Ansys.jpg)
Ansys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs. RaptorX is now certified for TSMC's N5 technology — crucial for modeling on-chip electromagnetic integrity in radio frequency systems, 5G, telecommunications, datacenters, and 3D-IC heterogeneous silicon systems.
Ansys has also collaborated with TSMC on an AI-enabled analysis optimization flow using Ansys optiSLang™ and Ansys multiphysics solutions, including RaptorX, RedHawk-SC, and RedHawk-SC Electrothermal.
"The significant power and performance boost delivered by our most advanced 2nm process technology is driving customers' needs for accurate and comprehensive multiphysics analysis," said Dan Kochpatcharin, head of design infrastructure management division at TSMC. "Our latest collaboration with Ansys delivers power integrity solutions for our most advanced process technologies that are pivotal to enable customer designs, and we have extended our partnership with Ansys to include RaptorX to manage the growing influence of electromagnetic effects in high-speed circuits."
"The Ansys multiphysics platform boasts strong technical solutions for power integrity and high-speed electromagnetics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Our collaboration with TSMC empowers our joint customers with the most advanced multiphysics simulations and analyses, enabling them to design some of the most innovative and advanced chips in the world."
Suggested Items
Ansys Works with Supermicro and NVIDIA to Deliver Unmatched Multiphysics Simulation with Turnkey Hardware
07/19/2024 | ANSYSAnsys is collaborating with Supermicro and NVIDIA to deliver turnkey hardware, enabling unmatched acceleration for Ansys multiphysics simulation solutions.
Ansys Multiphysics Signoff Solutions Certified for Samsung’s 2nm Power Backside Delivery Technology
06/26/2024 | ANSYSAnsys power integrity solutions have been certified by Samsung Foundry for use with Samsung’s new SF2Z 2nm gate-all-around manufacturing technology.
Ansys to Demonstrate 3D Multiphysics Visualization of Electromagnetic and Thermal Effects in Semiconductor Packages at Design Automation Conference
06/20/2024 | ANSYSAnsys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization. Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization.
Ansys Stockholders Approve Transaction with Synopsys
05/24/2024 | ANSYSAnsys announced that at the special meeting of stockholders held earlier today, its stockholders voted to approve the proposed acquisition of Ansys by Synopsys, Inc.
Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation
05/09/2024 | ANSYSAnsys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.