Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Diraq Deploys First Silicon Spin Quantum Computer in Commercial Data Center

11/12/2026 | Diraq
Diraq has installed the world's first silicon spin quantum computer inside a commercial data center, now live at Equinix in Sydney, Australia.

Powering the Future: Why Engineers Are Switching to Ceramic Substrates

11/12/2026 | Brian Buyea -- Column: Powering the Future
Walk into any design review, whether it’s for an EV inverter, a radar system, or a high-frequency amplifier, and you’ll hear the same concern repeated in different ways: “How are we managing the heat?” That question, more than anything else, is driving one of the most important material shifts happening in electronics today. Engineers are moving deliberately and increasingly toward ceramic substrates. Not because they’re trendy, but because they solve problems that traditional materials simply can’t solve anymore.

Koh Young’s Answer to Wafer-level Inspection Challenges

11/12/2026 | Marcy LaRont, I-Connect007
At SEMICON West, I caught up with Allen Phung, head of sales at Koh Young America, where we pivoted from our more traditional focus on SMT-related tech to talking about semiconductors and advanced packaging. Koh Young’s semiconductor business provides inspection and metrology systems for advanced packaging, including micro-solder deposits, high-density substrates, and wafer-level packaging, addressing the demanding requirements as components shrink and interconnect complexity grows.

Keysight Brings Radio Frequency and Photonic Design Together for Tower Semiconductor

11/10/2026 | BUSINESS WIRE
Keysight Technologies, Inc. has certified Advanced Design System (ADS) Photonic Designer to support Tower Semiconductor’s PH18 silicon photonics process design kits (PDKs).

Below the Surface: What Actually Works When Designing Electronics for Harsh Environments

11/12/2026 | Chandra Gupta -- Column: Below the Surface
Ask engineers how to design electronics for extreme environments, and you’ll hear plenty of confident answers, like “Use thicker copper” or “Add a heat sink.” That advice is useful, but it is not enough. When electronics fail in harsh environments because of temperature, shock, and vibration, it is rarely due to a single obvious mistake. More often, failure results from a chain of small, “good enough” decisions that cannot withstand extreme stress.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in