-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
May 1, 2024 | PRNewswireEstimated reading time: 2 minutes

HQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
This year IPC, the Global Association for Electronics Manufacturing hosted the 16th Electronics Circuits World Convention (ECWC16) and IPC APEX Expo where HQ NextPCB of HQ Electronics demonstrated its EMS capabilities and positioned itself in the global electronics manufacturing industry.
IPC APEX Expo 2024 saw equipment and materials manufacturers, PCB fabricators and assembly houses, OEMs and electronic manufacturing service (EMS) providers present their latest offerings and developments in the electronics manufacturing space. The industry's largest event in North America, the Anaheim Convention Center in Los Angeles saw over 7000 visitors from 57 countries engage in productive business development and networking.
As HQ NextPCB's first IPC APEX and non-Asia appearance, the show exceeded expectations and saw meaningful and insightful conversations with prime customers, resulting in numerous new leads from both old and new faces. HQ Electronics' overseas strategy aims to promote greater awareness of the international divisions, HQ NextPCB and HQ Online and HQ Electronics as a whole in key markets by creating more opportunities for open dialogue with businesses and discuss their challenges.
Reflecting on the event, HQ NextPCB representative Carmen Zheng commented, "It was very rewarding to refresh old bonds and finally be able to put names to faces, or faces to names rather. Learning about the needs of local contract manufacturers and product developers was truly an eye-opening experience, something we would have never gained sitting in front of a desk halfway across the world."
A highlight of the event for HQ NextPCB was meeting long-term client Calvin Taylor of Warn Industries, in which they were able to correct his previous understanding that HQ NextPCB only focused on prototype orders.
"One of the most touching aspects of participating in exhibitions is the opportunity to meet our customers, particularly those who've journeyed alongside us as they've grown. Listening to their stories, from the birth of a prototype to its evolution into mass production, fills our team with an immense sense of pride. We are deeply thankful for the trust our customers place in us, and it is an honor to be seen as a steadfast partner in their supply chain," said Ivy Li, Head of International Business at HQ Electronics
HQ Electronics will also be participating in the PCIM Europe in Nuremberg Germany this summer. They can be found at booth 126, Hall 5 from June 11-13th and there will be a special HQDFM presentation by Carmen on the 13th.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Delta Electronics Posts 26.7% Growth in Sales Revenues for August
09/12/2025 | Delta ElectronicsDelta Electronics, Inc. announced its consolidated sales revenues for August 2025 totaled NT$47,860 million, a 26.7 percent increase as compared to NT$37,770 million for August 2024 and a 5.4 percent increase as compared to NT$45,397 million for July 2025.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.