-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Schweizer Electronic: Business Development in Q1 2024
May 8, 2024 | Schweizer Electronic AGEstimated reading time: 1 minute
The sales of the SCHWEIZER Group amounted to EUR 39.2 million in the first quarter of 2024 (Q1 2023: EUR 37.1 million). This corresponds to an increase of +5.5 percent compared to the same quarter of the previous year. The first quarter of 2023 still included a revenue of EUR 1.8 million from the associated company Schweizer Electronic (Jiangsu) Co, Ltd, China (“SEC”). Thus the increase of sales without SEC corresponds to 11.0%. Sales from own production amounted to EUR 24.3 million and thus were slightly higher than in the same quarter of the previous year (Q1 2023: EUR 24.2 million). The sales of products via our Asian partner network increased by 14.8% year-on-year to EUR 14.9 million, accounting for 37.9% of sales (Q1 2023: 34.9%). The share of revenue generated by own production amounted to 62.1% (Q1 2023: 65.1%). Sales to Automotive customers amounted to EUR 31.3 million (Q1 2023: EUR 24.9 million), which corresponds to an increase of +25.7% compared to the first quarter of 2023. Automotive customers accounted for 80.0% of revenue in the first quarter of 2024 (Q1 2023: 67.1%).
The order backlog was EUR 224.9 million at the end of the quarter (December 31, 2023: EUR 251.3 million).
Earnings before interest, taxes, depreciation and amortization (EBITDA) grew to EUR +2.1 million (Q1 2023: EUR +0.4 million). The EBITDA ratio amounted to +5.2% and was therefore 4.2 percentage points higher than in Q1 2023. Adjusted for the negative EBITDA contribution from SEC in Q1 2023, EBITDA fell by EUR -1.4 million in Q1 2024.
Equity amounted to EUR 24.9 million at the end of the quarter (31.12.2023: EUR 25.8 million). The change was mainly due to the loss allocation of EUR -1.1 million from SEC, which is held as a financial investment (at equity). Non-current financial liabilities decreased by EUR -0.6 million. Net debt increased compared to the end of the year to EUR 18.1 million (31.12.2023: EUR 16.6 million).
Forecast confirmed
The management confirms the forecast issued as part of the publication of the 2023 business figures. Due to the positive developments in sales of the embedding technology, the Executive Board confirms the revenue target of EUR 140 to 150 million and the EBITDA forecast of between EUR +10 and +11 million (2023 adjusted EBITDA: EUR +8.9 million) for 2024. It should be noted that there is currently an accelerated development of the revenue structure towards products from the Asian partner company. This may have a negative impact on the margin. The structural shifts are being balanced by targeted measures to adjust the cost structure.
Suggested Items
IPC President’s Award: Dr. Thomas Marktscheffel
04/15/2025 | Nolan Johnson, I-Connect007At ASMPT SMT Solutions, Thomas Marktscheffel, director of product management software solutions, is responsible for the SMT line software portfolio. As a member and leader of several IPC committees, he is also a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852, which make it possible to provide plug-and-play connectivity for intelligent SMT Factories. In 2015, he participated in the IPC-1782 A-team and subsequently joined the IPC-2591 CFX standard A-team, which became the new SMT industry communication standard following its first release in March 2019. He was also active on the IPC-HERMES-9852, IPC-2551, IPC-2552, and IPC-2553 teams, with the overarching goal of providing a reasonable set of IPC standards for the Factory of the Future. He is currently chair of the IPC 2-10 Committee, co-chair of the IPC-2591 CFX Task Group, and chair of several A-teams.
BEST Inc to Host Soldering 101 Workshop at Illinois & Michigan Locations
04/15/2025 | BEST Inc.BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host multiple Soldering 101 workshops in its Rolling Meadows, Illinois and Lansing, Michigan locations.
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
04/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Explore TRI's Test and Inspection Innovations at ElectroneX
04/15/2025 | TRIGPC Electronics, TRI's industry partner, will participate in the ElectroneX Electronics Design & Assembly Expo 2025 at the Melbourne Convention & Exhibition Centre, Australia, on May 7–8, 2025.
Northrop Grumman Achieves First-Ever Undocking Between Two Commercial Spacecraft in Geosynchronous Orbit
04/14/2025 | Northrop GrummanA Mission Extension Vehicle (MEV) developed by Northrop Grumman Corporation’s Space Logistics LLC has successfully undocked with Intelsat’s IS-901 satellite, completing its life extension service.