-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
May 16, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: 1 minute

You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine, our annual review of everything that happened during our week in Anaheim, California.
“A special thank you to the IPC team for organizing such a powerful event,” says Barry Matties, publisher of I-Connect007. The Technical Conference was world-class, and the well-thought-out Professional Development Courses are helping many to grow in their careers. The Emerging Engineer program is growing and helping our industry become better.”
What will you find inside this issue?
- Show reviews from industry professionals who traversed the show floor, attended conference sessions, and helped to connect all the pieces that this show offers.
- A view through a photographer's lens in our many photo galleries, capturing the show floor, keynote speakers, receptions, and of course, the guests.
- Nearly 100 video interviews with industry leaders who share topics of interest, including the latest innovations and product releases from their companies.
- Interviews with many of the recipients of IPC’s annual awards, including Hall of Fame, Dieter Bergman Fellowship Award, President’s Award, Rising Star, Best Technical Paper, Best Student Poster, and committee volunteers.
- Reviews of the three keynote speakers, winners of the IPC Design Competition, a review of Factory of the Future/CFX, and standards activity.
“In the end, it took many hands to make light work,” Matties says. “So, a big thank you to all who worked to make this show valuable to the industry and help us build electronics better.”
Click here to see what's inside!
Download a pdf copy.
Like what you see? Share the issue with your connections on LinkedIn by copying and posting this link.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.