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epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
May 13, 2024 | epoxySetEstimated reading time: Less than a minute
epoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components. The low CTE of 34 ppm/°C also keeps the stresses to a minimum. It offers superior bond strength to most substrates as well as very high chemical and moisture resistance.
The EC-1015HP has a high thermal conductivity of 1.2W/m°K with a glass transition temperature of 162°C. It is an ideal choice for protection of electrical components with a volume resistivity of 10*16 ohm-cm and a dielectric strength of 450V/ml.
This formulation can be used in densely packaged power supplies, integrated circuits, tightly packed coils and transformers without the cracking issues associated with most epoxies.
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