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TRI Releases Core Features 3D AOI Solution

09/23/2024 | TRI
Test Research, Inc. (TRI) is pleased to introduce the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.

Cirexx International Inc. Chooses atg A9 Flying Probe Technology for High-speed Electrical Test  

09/19/2024 | atg Luther & Maelzer GmbH
atg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator, Cirexx International Inc., in Santa Clara, CA.

Transtec and YAMAHA Motor Robotics to Showcase Latest Technology at SMTAI 2024

09/18/2024 | Yamaha Motor Robotics Holdings Co., Ltd.
Trans-Tec America, in Partnership with Yamaha Robotics USA, will exhibit dynamic SMT assembly technologies at the SMTAI 2024 trade show and conference, October 20 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.

Circuit Technology Center Announces Expanded Tinning Services Capacity

09/16/2024 | Circuit Technology Center
Circuit Technology Center announces it has expanded its electronic component tinning services capacity.  Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.

The Chemical Connection: Chemical and Equipment Control of High-density Circuits, Part 2

08/27/2024 | Don Ball -- Column: The Chemical Connection
In my June column, I discussed how much control was needed for high-density circuits rather than what was thought necessary. I concentrated on cupric chloride and alkaline etch issues and equipment, since the etching step in the circuit board manufacturing process is one of the most critical areas where small changes in etchant parameters can have a large effect on the final product. The intention was to continue in the July issue with less critical process steps, such as developing and stripping. However, I got distracted by a specific control issue for alkaline etch, specifically controlling your alkaline etch process when you’re not etching a lot of copper. So, this month, I’m picking up where I left off in June.
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