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Breaking High-speed Material Constraints: Design007 Magazine — May 2024
May 14, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates and the high-speed laminates developed especially for high-speed PCBs.
But then traditional laminates started getting better, and high-speed designers and design engineers took notice. The resin systems have improved to the point that designers are now using flavors of FR-4 for some high-speed PCBs, saving time and money, while streamlining the fab process. In this issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards. Don’t miss it.
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TRI Releases Core Features 3D AOI Solution
09/23/2024 | TRITest Research, Inc. (TRI) is pleased to introduce the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.
Cirexx International Inc. Chooses atg A9 Flying Probe Technology for High-speed Electrical Test
09/19/2024 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator, Cirexx International Inc., in Santa Clara, CA.
Transtec and YAMAHA Motor Robotics to Showcase Latest Technology at SMTAI 2024
09/18/2024 | Yamaha Motor Robotics Holdings Co., Ltd.Trans-Tec America, in Partnership with Yamaha Robotics USA, will exhibit dynamic SMT assembly technologies at the SMTAI 2024 trade show and conference, October 20 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
Circuit Technology Center Announces Expanded Tinning Services Capacity
09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
The Chemical Connection: Chemical and Equipment Control of High-density Circuits, Part 2
08/27/2024 | Don Ball -- Column: The Chemical ConnectionIn my June column, I discussed how much control was needed for high-density circuits rather than what was thought necessary. I concentrated on cupric chloride and alkaline etch issues and equipment, since the etching step in the circuit board manufacturing process is one of the most critical areas where small changes in etchant parameters can have a large effect on the final product. The intention was to continue in the July issue with less critical process steps, such as developing and stripping. However, I got distracted by a specific control issue for alkaline etch, specifically controlling your alkaline etch process when you’re not etching a lot of copper. So, this month, I’m picking up where I left off in June.