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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 20, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Which reminds me: If you’re not a subscriber to our Daily Newsletter, I encourage you to go to my I-Connect007 right now and subscribe. It’s free, and you can choose all the targeted content you want, from magazines to newsletters. You won’t regret it.
It’ll be 2025 soon enough, so I close out this year wishing you all a wonderful holiday season.
Automotive PCB Market Share to Rise at 5.4% CAGR, to Reach $16.43 Billion by 2034
Published December 18
The report establishes that:
- The market for automotive PCB is driven by a notable rise in electrification and modernization of vehicles.
- The double-sided PCB segment is expected to experience the highest CAGR during the forecast period.
There is more in the report that is well worth a review.
Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components
Published December 13
As most of us know, Bosch is a tier 1 automotive supplier. This proposed $225 million investment would support Bosch’s planned $1.9 billion investment in its in Roseville, California facility, which produces silicon carbide (SiC) power semiconductors. This proposed expansion of this, Bosch’s largest SiC device factory would increase production capacity, create up to 1,000 construction jobs and up to 700 manufacturing, engineering, and research and development jobs in California.
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
Published December 17
Ventec continues expanding manufacturing outside China. This $17 million Thai facility will be built on 8.4 acres in the Hi-Tech Industrial Estate in the Ayutthaya province north of Bangkok. This project would seem to reinforce Ventec’s commitment to global supply chain resiliency, and customer proximity in the developing Southeast Asia PCB manufacturing hub.
Sayonara to the Last Standing Copper Foil Plant in North America
Published December 17
The U.S. is now faced with the closure of the last standing copper foil manufacturing plant in North America serving the PCB fabrication industry and supporting many U.S. military and defense products. Undoubtedly this will cause a ripple within the U.S. supply chain. Read more of Marcy LaRont’s analysis here.
EMI Shielding Market worth $9.69 Billion in 2029
Published December 19
What’s creating this sort of growth in EMI shielding? The report stipulates that pressure to meet strict EMC standards has increased regulatory requirements, and the emergence of connected and smart devices has sharply increased the demand for advanced shielding materials.Just another reminder that the electronics industry continues to morph into a holistic design-and-manufacture operational model. To my point, EMI shielding used to be effectively a mechanical design consideration; increasingly, it needs to be specified during board design.
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Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute
03/15/2026 | Marcy LaRont, I-Connect007The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.