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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 20, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Which reminds me: If you’re not a subscriber to our Daily Newsletter, I encourage you to go to my I-Connect007 right now and subscribe. It’s free, and you can choose all the targeted content you want, from magazines to newsletters. You won’t regret it.
It’ll be 2025 soon enough, so I close out this year wishing you all a wonderful holiday season.
Automotive PCB Market Share to Rise at 5.4% CAGR, to Reach $16.43 Billion by 2034
Published December 18
The report establishes that:
- The market for automotive PCB is driven by a notable rise in electrification and modernization of vehicles.
- The double-sided PCB segment is expected to experience the highest CAGR during the forecast period.
There is more in the report that is well worth a review.
Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components
Published December 13
As most of us know, Bosch is a tier 1 automotive supplier. This proposed $225 million investment would support Bosch’s planned $1.9 billion investment in its in Roseville, California facility, which produces silicon carbide (SiC) power semiconductors. This proposed expansion of this, Bosch’s largest SiC device factory would increase production capacity, create up to 1,000 construction jobs and up to 700 manufacturing, engineering, and research and development jobs in California.
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
Published December 17
Ventec continues expanding manufacturing outside China. This $17 million Thai facility will be built on 8.4 acres in the Hi-Tech Industrial Estate in the Ayutthaya province north of Bangkok. This project would seem to reinforce Ventec’s commitment to global supply chain resiliency, and customer proximity in the developing Southeast Asia PCB manufacturing hub.
Sayonara to the Last Standing Copper Foil Plant in North America
Published December 17
The U.S. is now faced with the closure of the last standing copper foil manufacturing plant in North America serving the PCB fabrication industry and supporting many U.S. military and defense products. Undoubtedly this will cause a ripple within the U.S. supply chain. Read more of Marcy LaRont’s analysis here.
EMI Shielding Market worth $9.69 Billion in 2029
Published December 19
What’s creating this sort of growth in EMI shielding? The report stipulates that pressure to meet strict EMC standards has increased regulatory requirements, and the emergence of connected and smart devices has sharply increased the demand for advanced shielding materials.Just another reminder that the electronics industry continues to morph into a holistic design-and-manufacture operational model. To my point, EMI shielding used to be effectively a mechanical design consideration; increasingly, it needs to be specified during board design.
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Brent Fischthal - Koh YoungSuggested Items
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/20/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.