-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
BTU International Displays Multiple Reflow Solutions at SMTconnect 2024
May 14, 2024 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce its participation in SMTconnect 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. The company will exhibit its latest innovations in reflow technology at the booths of its manufacturers' representatives, ANS answer elektronik Service- & Vertriebs GmbH and Stratus Vision GmbH.
ANS, located at Hall 4, Booths 245-345, and Stratus Vision, located in Hall 4 Booth 247, will host BTU International's advanced reflow solutions. BTU will feature its Pyramax 100A unit in the ANS booth and the Aqua Scrub™ Flux Management unit in the Stratus booth, offering attendees firsthand experience with state-of-the-art thermal processing equipment.
The Pyramax 100A reflow oven integrates advanced features, including closed-loop convection control and the Wincon oven control system, to deliver superior performance and reliability within a compact footprint. Designed to meet the evolving demands of modern electronics manufacturing, the Pyramax 100A ensures precise temperature control and uniform heating for optimal soldering results.
In the Stratus Vision booth, BTU International will highlight its Aqua Scrub™ Flux Management Technology. This next-generation solder reflow flux management system is engineered to significantly reduce operational costs compared to traditional condensation systems. Aqua Scrub's patent-pending design utilizes aqueous-based scrubber technology compatible with a wide range of paste and flux types, offering enhanced efficiency and productivity while drastically lowering scheduled downtime. The Aqua Scrub flux management system is designed within the new Aurora platform of reflow ovens and can also be retrofitted to current Pyramax units.
Company representatives will discuss how the new Aurora platform is guiding the way to the lights out Industry 4.0 factory of the future by seeing reflow in a new light. Implementing the industry’s first factory configurable heating and cooling zones provides the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling constraints, or increased throughput requirements.
For a hands-on view of the BTU equipment and its portfolio of thermal processing solutions, please visit ANS at Hall 4, Booth 245-345 and Stratus Vision at Hall 4, Booth 247 at SMTconnect 2024.
Suggested Items
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3
08/14/2024 | I-Connect007 Editorial TeamChapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.
Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024
08/08/2024 | SolderStarSolderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24.