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Siemens Debuts Fast, Accurate and Context-aware Electrostatic Discharge Verification Solution Spanning all Phases of IC Design

06/26/2024 | Siemens
Siemens Digital Industries Software announced today a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.

Global Sourcing Spotlight: How Travel Has Enhanced My Life and Work

06/26/2024 | Bob Duke -- Column: Global Sourcing Spotlight
One of the great things about my job as president of ASC Global Sourcing is that I get to travel around the world, and the best part about that is meeting people of all nationalities and origins. Although we all come from various and different backgrounds, in so many ways we are the same. Most of us share the same family values and love of our country. When it comes to taking our work seriously and wanting to do the best job, we also have pretty similar beliefs.

Semidynamics Releases Tensor Unit Efficiency data for its new All-In-One AI IP

06/25/2024 | Semidynamics
Semidynamics, the European RISC-V custom core AI specialist, has announced Tensor Unit efficiency data for its ‘All-In-One’ AI IP running a LlaMA-2 7B-parameter Large Language Model (LLM).

Siemens, Intel Foundry Collaborate to Deliver New Tools Certifications and EMIB/3D-IC Innovation

06/25/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced that its ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) product certification, as well as an embedded multi-die interconnect bridge (EMIB) enablement breakthrough that can help mutual customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs much more quickly.

Beyond Prepreg: The Glassless ‘Revolution’

06/25/2024 | Marcy LaRont, PCB007 Magazine
As our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.
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