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SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
May 15, 2024 | SEMIEstimated reading time: 3 minutes
SEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues. The event, North America’s premier exhibition and conference for the semiconductor supply chain, will feature keynotes and executive panels with thought leaders from the electronics design and manufacturing ecosystem, academia, and government. Registration is open. Reflecting the intensifying interest in U.S. chip manufacturing, booths in the exhibition halls are sold out.
Themed Stronger Together, SEMICON West 2024 will highlight market trends and critical industry issues including supply chain resilience, heterogeneous integration, cybersecurity, sustainability, and workforce development. The event will also explore the implications of artificial intelligence (AI) as its proliferation continues.
Aimed at fostering global industry growth and innovation, the CEO Summit keynote series returns to highlight investments in the U.S. semiconductor industry. The series will bring together government and industry leaders to address investment opportunities in the U.S. semiconductor supply chain and global industry issues.
“Continuing government and private investment in the U.S. semiconductor industry is critical to expanding the region’s chip ecosystem and strengthening the resilience of the global supply chain,” said Joe Stockunas, President of SEMI Americas. “The grants and tax incentives offered under the CHIPS and Science Act have become a key driver of the expansion of the domestic chip manufacturing industry. We look forward to hosting leaders from government and industry as they explore global growth opportunities and headwinds ahead, including those surrounding AI.”
CEO Summit Day 1 - Investing in America’s Path Forward
This session will feature updates on the CHIPS Act and state support from government officials, highlighting the $225 billion in public and private investments committed to the industry since the enactment of the U.S. federal statute. Leaders from companies across the supply chain including device manufacturers, equipment suppliers, and materials providers will present.
CEO Summit Day 2 - Seizing the Global Opportunities and Challenges Ahead
Speakers will address pressing global semiconductor industry issues including supply chain resilience, sustainability, talent, and the state of Moore’s Law.
Also highlighting the CEO Summit will be the executive panel titled Beyond Tier Mapping – Creating a Robust and Resilient Supply Chain Risk Management Program. The panel of supply chain experts will explore solutions to multi-tier supply chain mapping and risk management issues.
CEO Summit Keynote Speakers
- Prabu Raja, Ph.D., President, Semiconductor Products Group: Applied Materials
- Sandra Watson, President and CEO: Arizona Commerce Authority
- Hichem M’Saad, Chair of the Management Board and Chief Executive Officer: ASM
- Mike Wilson, Executive Vice President, Global Logistics Manufacturing Services & Inventory Management Solutions, EVP Latin America: DSV
- John Langan, Ph.D., CTO: EMD Electronics
- Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany and CEO Electronics: EMD Electronics
- Bertrand Loy, President and CEO: Entegris
- Herbert Blaschitz, Executive Vice President, Global Business Unit Advanced Technology Facilities (ATF): Exyte
- Thomas Caulfield, Ph.D., President and CEO: GlobalFoundries
- Keyvan Esfarjani, Executive VP, Chief Global Operations Officer, General Manager, Foundry Manufacturing and Supply Chain: Intel
- Todd Brady, VP Global Public Affairs and Chief Sustainability Officer: Intel
- Gabriela Cruz Thompson, Director of University Research Collaboration: Intel Labs, Intel
- Sandra Mahadwar, Chief Inclusion and Diversity Officer and Senior VP, Talent Management: KLA
- Tim Archer, President and CEO: Lam Research
- Scott Gatzemeier, Corporate Vice President, Front End US Expansion: Micron Technology
- Jeff Thomas, Executive VP, Corporate Platforms: Nasdaq
- Angela Baker, Chief Sustainability Officer: Qualcomm
- Subodh Kulkarni, Ph.D., President and CEO: Rigetti
- Agustin Lopez Diaz, Chief Sustainability Officer and Customer Satisfaction and Quality Officer: Schneider Electric
- Larry Smith, Executive Committee Inaugural Member of the Texas Semiconductor Innovation Consortium: TEL
- Jose Fernandez, Assistant Secretary of State for Economic Energy and Business Affairs: U.S. Department of State
FLEX Conference & Exhibition
Co-located with SEMICON West 2024, the FLEX Conference & Exhibition will feature keynotes, panel discussions, technical sessions, funding opportunities, product-based demonstrations and industry tours highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging, including heterogeneous integration. Keynote speakers will include experts from industry leaders such as Advanced Semiconductor Engineering, Axiom Space, Intel, and Toyota Research Institute of North America.
The SEMI Market Symposium returns on Monday, July 8 with a midyear update on key market trends and drivers. Leading industry analysts will present market forecasts for the semiconductor, equipment, materials, and other industries in the electronics design and manufacturing space.
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Rohde & Schwarz Joins AI-RAN Alliance and Leverages its T&M Expertise to Unlock Potential of AI for Wireless Communications
06/25/2024 | Rohde & SchwarzRohde & Schwarz has become the latest member of the recently formed AI-RAN Alliance. As a global leader in wireless testing, the company will contribute its T&M expertise to this new collaborative initiative, which aims to integrate artificial intelligence (AI) into wireless communications to advance radio access network (RAN) performance and mobile networks.
Career Opportunities Are Knocking
06/25/2024 | I-Connect007 Editorial TeamAre workforce topics on your mind? In this market, of course they are! Finding and keeping qualified employees is continually cited as one of today’s greatest business challenges. That's why I-Connect007 features Career Opportunities in every magazine issue. Whether you’re looking to hire or be hired, check out the Career Opportunities section in every issue of our magazines.
USPAE’s Jim Will on PCBMC, Defense Needs, and Onshoring
06/25/2024 | I-Connect007 Editorial TeamJim Will has assumed the role of executive director of the U.S. Partnership for Assured Electronics (USPAE). In his first interview with I-Connect007, Jim discusses his background in the commercial and defense industries, emphasizing U.S. defense assured electronics needs. His passion shows through as he discusses USPAE initiatives and looks forward to finding ways for partner organizations to work more closely together.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.