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The Legislative Outlook: Helping or Hurting?
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SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
May 15, 2024 | SEMIEstimated reading time: 3 minutes
SEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues. The event, North America’s premier exhibition and conference for the semiconductor supply chain, will feature keynotes and executive panels with thought leaders from the electronics design and manufacturing ecosystem, academia, and government. Registration is open. Reflecting the intensifying interest in U.S. chip manufacturing, booths in the exhibition halls are sold out.
Themed Stronger Together, SEMICON West 2024 will highlight market trends and critical industry issues including supply chain resilience, heterogeneous integration, cybersecurity, sustainability, and workforce development. The event will also explore the implications of artificial intelligence (AI) as its proliferation continues.
Aimed at fostering global industry growth and innovation, the CEO Summit keynote series returns to highlight investments in the U.S. semiconductor industry. The series will bring together government and industry leaders to address investment opportunities in the U.S. semiconductor supply chain and global industry issues.
“Continuing government and private investment in the U.S. semiconductor industry is critical to expanding the region’s chip ecosystem and strengthening the resilience of the global supply chain,” said Joe Stockunas, President of SEMI Americas. “The grants and tax incentives offered under the CHIPS and Science Act have become a key driver of the expansion of the domestic chip manufacturing industry. We look forward to hosting leaders from government and industry as they explore global growth opportunities and headwinds ahead, including those surrounding AI.”
CEO Summit Day 1 - Investing in America’s Path Forward
This session will feature updates on the CHIPS Act and state support from government officials, highlighting the $225 billion in public and private investments committed to the industry since the enactment of the U.S. federal statute. Leaders from companies across the supply chain including device manufacturers, equipment suppliers, and materials providers will present.
CEO Summit Day 2 - Seizing the Global Opportunities and Challenges Ahead
Speakers will address pressing global semiconductor industry issues including supply chain resilience, sustainability, talent, and the state of Moore’s Law.
Also highlighting the CEO Summit will be the executive panel titled Beyond Tier Mapping – Creating a Robust and Resilient Supply Chain Risk Management Program. The panel of supply chain experts will explore solutions to multi-tier supply chain mapping and risk management issues.
CEO Summit Keynote Speakers
- Prabu Raja, Ph.D., President, Semiconductor Products Group: Applied Materials
- Sandra Watson, President and CEO: Arizona Commerce Authority
- Hichem M’Saad, Chair of the Management Board and Chief Executive Officer: ASM
- Mike Wilson, Executive Vice President, Global Logistics Manufacturing Services & Inventory Management Solutions, EVP Latin America: DSV
- John Langan, Ph.D., CTO: EMD Electronics
- Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany and CEO Electronics: EMD Electronics
- Bertrand Loy, President and CEO: Entegris
- Herbert Blaschitz, Executive Vice President, Global Business Unit Advanced Technology Facilities (ATF): Exyte
- Thomas Caulfield, Ph.D., President and CEO: GlobalFoundries
- Keyvan Esfarjani, Executive VP, Chief Global Operations Officer, General Manager, Foundry Manufacturing and Supply Chain: Intel
- Todd Brady, VP Global Public Affairs and Chief Sustainability Officer: Intel
- Gabriela Cruz Thompson, Director of University Research Collaboration: Intel Labs, Intel
- Sandra Mahadwar, Chief Inclusion and Diversity Officer and Senior VP, Talent Management: KLA
- Tim Archer, President and CEO: Lam Research
- Scott Gatzemeier, Corporate Vice President, Front End US Expansion: Micron Technology
- Jeff Thomas, Executive VP, Corporate Platforms: Nasdaq
- Angela Baker, Chief Sustainability Officer: Qualcomm
- Subodh Kulkarni, Ph.D., President and CEO: Rigetti
- Agustin Lopez Diaz, Chief Sustainability Officer and Customer Satisfaction and Quality Officer: Schneider Electric
- Larry Smith, Executive Committee Inaugural Member of the Texas Semiconductor Innovation Consortium: TEL
- Jose Fernandez, Assistant Secretary of State for Economic Energy and Business Affairs: U.S. Department of State
FLEX Conference & Exhibition
Co-located with SEMICON West 2024, the FLEX Conference & Exhibition will feature keynotes, panel discussions, technical sessions, funding opportunities, product-based demonstrations and industry tours highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging, including heterogeneous integration. Keynote speakers will include experts from industry leaders such as Advanced Semiconductor Engineering, Axiom Space, Intel, and Toyota Research Institute of North America.
The SEMI Market Symposium returns on Monday, July 8 with a midyear update on key market trends and drivers. Leading industry analysts will present market forecasts for the semiconductor, equipment, materials, and other industries in the electronics design and manufacturing space.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.