-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
European Chips Skills Academy Launches Summer School in Italy to Promote Microelectronics Industry Careers
May 16, 2024 | SEMIEstimated reading time: 1 minute
University students will connect with professors to explore semiconductor learning paths and employment opportunities at the European Chip Skills Academy Summer School, August 18-23, 2024 in Bologna, Italy. Supported by SEMI and held in collaboration with AENEAS, EPoSS, and Inside, the event is integral to the European Chips Skills Academy, an EU-funded project coordinated by SEMI Europe. The event will be held at the University Residential Centre, University of Bologna, Bertinoro, Italy. Registration is open.
The ECS Academy, funded through the Erasmus+ program, aims to foster dialogue, strategic planning, and actionable steps to help grow the microelectronics industry workforce.
The Summer School will serve as a key initiative of the ECS Academy for 2024, offering insights into current microelectronics technologies and anticipated future applications across the semiconductor value chain.
Summer School Key Topics
- Semiconductor Technology
- Integrated Circuits Design
- Digital Systems and Embedded Intelligence
- Integration, including Packaging and MEMS Technology
Other Event Highlights
- Networking Reception – Meet with peers and industry experts to explore semiconductor industry career paths.
- Meet like-minded students – Interact with peers with similar interests and motivations.
- Explore Bologna: Admire the city’s unique architecture, and in particular the red tiled rooftops.
Enrollment Criteria
The initiative is designed for STEM undergraduates’ students in the following categories:
- Preparing to declare a graduate degree major
- Considering to pursue a master’s degree
- Attending or currently enrolled in a university based in EU Member States and specified countries associated to the program
The Summer School will be complimentary. Some participants may qualify for a travel reimbursement of up to 600 EUR.
Student selection will be based on the applicant’s CV, a motivation letter, recommendation letters, and academic transcripts. The selection process will take into account gender and geographical balance to ensure diverse student backgrounds.
Suggested Items
Altair Signs Collaboration Agreement with the Faculty of Data and Decisions Science at the Technion – Israel Institute of Technology
09/03/2024 | AltairAltair, a global leader in computational intelligence, announced a collaboration with the Faculty of Data and Decisions Science at the Technion – Israel Institute of Technology. T
University Researchers Help Develop AI-Powered Drones to Prevent Wildfires
08/27/2024 | University of BristolA University of Bristol professor has joined forces with Lancashire Fire and Rescue and Windracers to test a swarm of self-coordinating drones for firefighting, as part of an effort to develop cost-effective early mitigation strategies for wildfires.
Indium Technical Manager to Present on Solder Solutions for Cutting-Edge Solutions for AI and Automotive at SEMICON Taiwan
08/26/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei,Taiwan. Chou’s presentation will highlight cutting-edge, high-reliability, and low-temperature solder solutions for these rapidly evolving markets.
Altair Signs MoU With University of Nottingham to Develop Aerospace Digital Twin Project
07/25/2024 | PRNewswireAltair, a global leader in computational intelligence, has signed a memorandum of understanding (MoU) with the U.K.-based University of Nottingham for a digital twin project within the aerospace sector.
Keysight, University of Malaga’s MobileNet Join Forces to Accelerate Open RAN Development with RAN Intelligent Controller Testing
07/23/2024 | BUSINESS WIREKeysight Technologies, Inc. announces that the University of Malaga, specifically the MobileNet: Mobile & Aerospace Networks Lab within the Telecommunications Institute (TELMA), has selected its RAN Intelligent Controller Test Solutions (RICtest).