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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
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TRI Opens New Manufacturing Facility
May 16, 2024 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announced that it has opened a state-of-the-art R&D and manufacturing facility.
TRI is committed to developing new technologies and inspection solutions for emerging markets, such as the Semiconductor and Advanced packaging. The facility will also offer dedicated Demo Rooms and a new space for Workshops and Seminars. The expansion substantially amplifies production capacity while conveniently positioned next to TRI's existing manufacturing hub in Linkou, Taiwan.
TRI offers a One Stop Solution for PCB Assembly and Advanced Packaging Testing and Inspection, which includes 3D Solder Paste Inspection (SPI), 3D Automated Optical Inspection (AOI), 3D CT Automated X-ray Inspection (AXI) and High-Performance In-Circuit Testing (ICT). TRI's solution portfolio has a wide range of high-end features and advanced functionality to meet current and future production line requirements.
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