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TRI Opens New Manufacturing Facility
May 16, 2024 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announced that it has opened a state-of-the-art R&D and manufacturing facility.
TRI is committed to developing new technologies and inspection solutions for emerging markets, such as the Semiconductor and Advanced packaging. The facility will also offer dedicated Demo Rooms and a new space for Workshops and Seminars. The expansion substantially amplifies production capacity while conveniently positioned next to TRI's existing manufacturing hub in Linkou, Taiwan.
TRI offers a One Stop Solution for PCB Assembly and Advanced Packaging Testing and Inspection, which includes 3D Solder Paste Inspection (SPI), 3D Automated Optical Inspection (AOI), 3D CT Automated X-ray Inspection (AXI) and High-Performance In-Circuit Testing (ICT). TRI's solution portfolio has a wide range of high-end features and advanced functionality to meet current and future production line requirements.
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Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
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Nolan's Notes: The Next Killer App in Component Manufacturing
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