The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
Real Time with… IPC APEX EXPO 2024: Insulectro on Attracting Young Talent to the Electronics Manufacturing Industry
May 16, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Insulectro's Doug Gotelli and Mitchell Benson explore the challenges of drawing young talent into the electronics manufacturing industry. They underscore the significance of manufacturing and the urgency of tackling the workforce shortage. They also discuss internship programs, the industry's resilience amid the pandemic, and the rewarding experiences of working in this sector.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Share on:
Suggested Items
NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
07/11/2025 | PRNewswireTaking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.
Mycronic Delivers Strong Q2 Performance and Raises 2025 Outlook to SEK 7.5 Billion
07/11/2025 | MycronicMycronic reported a 35% increase in Q2 net sales and a 27% EBIT margin, prompting an upward revision of its full-year 2025 revenue forecast to SEK 7.5 billion.
Cetec ERP Expands into Larger Office to Support Continued Growth
07/11/2025 | Cetec ERPCetec ERP, a leading provider of cloud-based ERP software for manufacturers, has officially relocated to a larger, modern office facility in central Austin as of July 2, 2025.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Kitron Reports Strengthening Momentum in Q2 2025
07/10/2025 | KitronKitron reported solid quarterly sales and profits, particularly driven by the Defence & Aerospace market sector.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in