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Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

12/13/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $225 million in proposed direct funding under the CHIPS and Science Act.

Saki Introduces Advanced X-Ray Inspection System for Next-Generation Miniaturized and Slim Power Modules

12/11/2024 | Saki Corp.
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of the 3Xi-M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series.

Incap India Wins the Environment Sustainability Award

12/11/2024 | Incap
Incap India is pleased to announce that it has been honoured with the Environment Sustainability Award by the Karnataka State Pollution Control Board (KSPCB).

SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects

12/11/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.

Real Time with... electronica 2024: STARTEAM GLOBAL Meeting Challenges Head-on

12/11/2024 | Real Time with... electronica
STARTEAM GLOBAL CEO Daniel Jacob and CTO Martin Schneider speak with Pete Starkey at electronica 2024 about their global presence in China, Thailand, and Europe, and how additive manufacturing and inkjet printing are keeping this PCB manufacturer at the forefront of technology. They’re excited about sustainability, the future, and competing on the world stage.
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