The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
Global Citizenship: The Global Push for Digital Inclusion
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Additive Manufacturing: PCB007 Magazine May 2024 Issue
May 20, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Repair, replace, or go in a completely different direction? Such is the crossroads at which many PCB fabricators find themselves when it comes to changing their current processes toward additive or staying the course until something significant compels a change. But change is afoot, and it would appear to be the vast technological leaps for chips and advanced packaging for which additive manufacturing offers the PCB fabricator some solutions to participate.
In this month’s issue of PCB007 Magazine, we talked to several industry members about additive manufacturing technology for the PCB fabricator. Though modern semi-additive and fully additive technologies are still emerging for PCB manufacturing, additive technology is not new. Our contributors to this issue discuss where it stands today, where the benefits truly lie, and where it seems to be headed.
Share on:
Suggested Items
STARTEAM GLOBAL Unveils Innovative Additive Solder Mask Process
06/02/2025 | STARTEAM GLOBALSTARTEAM GLOBAL, a leading PCB manufacturer, has introduced a revolutionary additive solder mask process at its Flero STARTEAM (FST) factory in Italy, leveraging digital inkjet technology to enhance production efficiency and sustainability.
Smart Automation: The Growing Role of Additive Manufacturing
04/23/2025 | Josh Casper -- Column: Smart AutomationAs additive manufacturing (AM) matures and reaches new business sectors throughout the manufacturing world, electronics manufacturing is beginning to reap the benefits of this ultra-flexible technology. AM (also known as 3D printing) capabilities have now expanded to support a wide range of applications in the electronics industry. The development of materials in additive manufacturing is meeting the demands of high-temperature environments and ESD protection necessary to become a viable solution in electronics manufacturing.
J.A.M.E.S. Explores the Future of Additive Manufactured Electronics
02/18/2025 | Marcy LaRont, I-Connect007Andreas Salomon is chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD. In this interview he discusses the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. These technologies enhance capabilities in signal integrity and miniaturization. He also talks about the importance of sustainability, the need for standardized testing, and collaboration among industry leaders that will drive innovation and transform the future of electronics manufacturing through IPC’s standards development.
Rogers Announces Addition of Woon Keat Moh to Board of Directors
12/23/2024 | Rogers CorporationRogers Corporation announced that Woon Keat Moh ("Moh") has been appointed as an independent member of the Company’s Board of Directors, effective January 1, 2025. Following this change, the Board will be composed of nine members, eight of whom are independent.
Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award
12/11/2024 | Nano DimensionNano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.