-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
SEMICON Europa 2024 Call for Abstracts Opens
May 21, 2024 | SEMIEstimated reading time: 1 minute
SEMI Europe announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.
Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2024 will gather industry-leading experts and innovators to explore cutting-edge technologies, materials, and process advancements driving the digital transformation and growth in the semiconductor industry. The exhibition and conference will be co-located with electronica.
Call for Abstracts – Events
Advanced Packaging Conference ─ Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency
The emergence of new types of neural networks like ChatGPT and other AI applications is driving unprecedented demand for high-performance computing (HPC) and innovations in advanced packaging – including for chiplets – heat dissipation, miniaturization, material integration, and power optimization. Abstracts on topics including growth through innovation, developments in design, manufacturing efficiency, and testing systems are invited.
Fab Management Forum ─ Industry Meets Innovative Ideas
Geared for fab managers, the Fab Management Forum will focus on optimizing next-generation core technologies such as SiC, photonics, and quantum computing to support industry growth. The forum will explore advancements in smart manufacturing solutions that leverage AI-driven tools for efficiency gains to address Europe's environmental sustainability goals and mitigate semiconductor industry-related environmental risks.
MEMS & Imaging Sensors Summit ─ MEMS and Imaging Young Talent
Entrepreneurs, start-up companies, and graduates will showcase their research and early-stage products to MEMS and imaging sensors technologists. Topics of interest include MEMS technologies, new applications and use cases, advancements in MEMS and sensors technology and materials, MEMS-photonics co-integration, and imaging technologies focused on new sensor applications, materials, and architectures.
Pre-recorded Innovation Presentations ─ Innovation and Collaboration: Powering Sustainable Exponential Growth
SEMI Europe will also highlight microelectronics and semiconductors innovations in short pre-recorded messages, pitches and product announcements by technologists. The videos will be aired on SEMICON Europa 2024 main stages during networking sessions and on the final day of the event.
Presentation abstracts, biographies and headshots must be submitted in English on the SEMICON Europa 2024 Call for Abstracts webpage by June 17, 2024. Selected presenters will be notified in August 2024.
Suggested Items
Celestica Announces Q2 2024 Financial Results
07/26/2024 | CelesticaCelestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world's most innovative companies, announced financial results for the quarter ended June 30, 2024 (Q2 2024)†.
Amphenol Reports Record Q2 2024 Results and Announces Dividend Increase
07/26/2024 | Amphenol CorporationThe Company continues to deploy its financial strength in a variety of ways to increase shareholder value. During the quarter, the Company purchased 3.1 million shares of its common stock for $190 million and paid dividends of $132 million, resulting in total capital returned to shareholders of more than $320 million.
Looking For That Perfect Job? Check Out jobCONNECT007
07/25/2024 | I-Connect007 Editorial TeamThere are a lot of open positions in this industry today. But where do you begin to look? We have the answer: jobCONNECT007, your guide to career opportunities in the electronic industry. In jobCONNECT007, you’ll find job openings that span the entire circuit board supply chain. Whether you’re involved in design, fabrication, assembly, test, or material development or distribution, this handy resource can help you get on your way to a new gig.
Boeing Provides Digital Flight Operations Solution for Ryanair
07/25/2024 | BoeingBoeing and Ryanair, Europe's largest airline group, are elevating efficiency across Ryanair's fleet of primarily 737s with the addition of Boeing's Jeppesen FliteDeck Pro 5.0 electronic flight bag (EFB) solution.
Cicor Group Grows Significantly and Shows Robust Operational Performance in a Challenging Environment
07/24/2024 | CicorCicor Group has continued to grow significantly in the first half of 2024, advancing into the top tier of European electronics manufacturers. Net sales reached CHF 231.3 million, an increase of 16.1% compared to CHF 199.2 million for the first half of 2023.