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The Chemical Connection: Reducing Etch System Water Usage, Part 1

04/05/2024 | Don Ball -- Column: The Chemical Connection
Water conservation has become an important component of the overall system design for most manufacturing operations today. Changing climate conditions and increasing populations are beginning to strain the freshwater supplies in many areas of the country. As a result, as equipment suppliers, we see an increasing number of requests for options that reduce water usage in proposed wet processing systems. Etching systems tend to use more water because of the need for close temperature control to maintain steady etch rates and the rinsing requirements for complete removal of corrosive etchants from the surface of the product before the next process step. This column contains some simple suggestions for reducing water usage in etch systems that won’t strain the budget too much.

Argonne Develops Plans to be Sure Nuclear Power Plants Stay Cool

04/05/2024 | BUSINESS WIRE
Climate scientists and nuclear science and engineering experts at the U.S. Department of Energy’s (DOE) Argonne National Laboratory are joining forces to develop a plan B for nuclear power in Richland, Washington.

Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era

03/19/2024 | Cadence Design Systems
Cadence Design Systems, Inc. introduced the industry’s first comprehensive AI-driven digital twin solution to facilitate sustainable data center design and modernization, marking a significant leap forward in optimizing data center energy efficiency and operational capacity.

ITRI, Intel Taiwan Unveil Cutting-Edge Joint Lab for HPC Cooling Certification

02/01/2024 | ITRI
ITRI and Intel Taiwan have inaugurated the ITRI-Intel Joint Lab for HPC Cooling Certification. This facility is dedicated to the development and validation of industrial immersion cooling solutions for high-performance computing.

Cadence Advances ECAD/MCAD Convergence with Celsius Studio AI Thermal Platform

02/01/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced Cadence® Celsius™ Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.
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