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STMicroelectronics to Boost AI at the Edge with New NPU-Accelerated STM32 Microcontrollers

12/11/2024 | STMicroelectronics
STMicroelectronics, is making embedded artificial intelligence (AI) truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine-learning (ML) capabilities.

Real Time with... electronica 2024: Revolutionizing Inspection—Delvitech AI Innovations

12/02/2024 | Real Time with... electronica
Pete Starkey Interviews Roberto Gatti, chief executive officer of Delvitech, which specializes in 3D automated optical inspection using advanced artificial intelligence. Founded in 2018, the company stands out by integrating AI with high-end hardware to enhance inspection capabilities. Its neural networks mimic human brain functions, improving results over time.

SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models

10/09/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
Since the introduction of ChatGPT on Nov. 30, 2022, and ChatGPT4 on March 14, 2023, large language models (LLMs) have been in everyday news and conversations. LLMs represent a significant advancement in AI, which has the potential to revolutionize multiple fields. This column offers a snapshot of LLMs from the user’s perspective.

BrainChip Introduces Lowest-Power AI Acceleration Co-Processor

10/02/2024 | BUSINESS WIRE
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, brain-inspired AI, today introduced the Akida™ Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable and sensor integrated AI into consumer, healthcare, IoT, defense and wake-up applications

SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1

04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.
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